JPS5522958B2 - - Google Patents

Info

Publication number
JPS5522958B2
JPS5522958B2 JP4157276A JP4157276A JPS5522958B2 JP S5522958 B2 JPS5522958 B2 JP S5522958B2 JP 4157276 A JP4157276 A JP 4157276A JP 4157276 A JP4157276 A JP 4157276A JP S5522958 B2 JPS5522958 B2 JP S5522958B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4157276A
Other languages
Japanese (ja)
Other versions
JPS52124168A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4157276A priority Critical patent/JPS52124168A/ja
Priority to DE2716330A priority patent/DE2716330B2/de
Priority to US05/786,944 priority patent/US4127432A/en
Priority to GB7715147A priority patent/GB1542614A/en
Publication of JPS52124168A publication Critical patent/JPS52124168A/ja
Publication of JPS5522958B2 publication Critical patent/JPS5522958B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1751—At least three articles
    • Y10T156/1754—At least two applied side by side to common base
    • Y10T156/1759—Sheet form common base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1763—Magazine stack directly contacting separate work
    • Y10T156/1766—Magazine movable to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53252—Means to simultaneously fasten three or more parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP4157276A 1976-04-12 1976-04-12 Method of assembling electronic device circuit Granted JPS52124168A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP4157276A JPS52124168A (en) 1976-04-12 1976-04-12 Method of assembling electronic device circuit
DE2716330A DE2716330B2 (de) 1976-04-12 1977-04-09 Verfahren zur Bestückung von Schaltungsplatinen mit plättchenförmigen Schaltungsbauteilen und Vorrichtung zur Durchführung des Verfahrens
US05/786,944 US4127432A (en) 1976-04-12 1977-04-12 Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same
GB7715147A GB1542614A (en) 1976-04-12 1977-04-12 Methods of and apparatus for mounting circuit elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4157276A JPS52124168A (en) 1976-04-12 1976-04-12 Method of assembling electronic device circuit

Publications (2)

Publication Number Publication Date
JPS52124168A JPS52124168A (en) 1977-10-18
JPS5522958B2 true JPS5522958B2 (en:Method) 1980-06-19

Family

ID=12612146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4157276A Granted JPS52124168A (en) 1976-04-12 1976-04-12 Method of assembling electronic device circuit

Country Status (2)

Country Link
US (1) US4127432A (en:Method)
JP (1) JPS52124168A (en:Method)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4292116A (en) * 1978-04-18 1981-09-29 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on a printed circuit board
JPS5565497A (en) * 1978-11-10 1980-05-16 Taiyo Yuden Kk Method of mounting electronic part
US4345371A (en) * 1979-03-14 1982-08-24 Sony Corporation Method and apparatus for manufacturing hybrid integrated circuits
JPS5627993A (en) * 1979-08-16 1981-03-18 Matsushita Electric Industrial Co Ltd Apparatus for mounting microminiature electronic part
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
FR2474270A1 (fr) * 1980-01-21 1981-07-24 Radiotechnique Compelec Procede et dispositif d'assemblage simultane de composants sur un support
US4461610A (en) * 1980-06-02 1984-07-24 Tdk Corporation Apparatus for mounting chip type circuit elements on printed circuit boards
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
IT1131749B (it) * 1980-07-22 1986-06-25 Ferco Spa Procedimento e relativo dispositivo di alimentazione di oggetti pressappoco parallelepipedi di dimensioni diverse il quale fornisce serie consecutive di oggetti su un piano di deposito unico
NL8006058A (nl) * 1980-11-06 1982-06-01 Philips Nv Inrichting voor het opschuiven van in magazijnen opgenomen onderdelen.
NL8201653A (nl) * 1982-04-21 1983-11-16 Philips Nv Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.
SE454643B (sv) * 1983-06-13 1988-05-16 Sincotron Aps Sett och anordning for att pa ett kretskort montera elektroniska komponenter
GB2147888B (en) * 1983-10-14 1986-12-31 Dage Precima International Lim Component stack feed device
US4548667A (en) * 1984-03-28 1985-10-22 Wical Robert M Planned coordinate component placement system
SE442021B (sv) * 1984-05-16 1985-11-25 Biodisk Ab Sett och anordning for anbringande av objekt sasom antibiotikalappar pa en mottagande nedatvend yta
KR910000998B1 (ko) * 1986-09-12 1991-02-19 마쯔시다덴기산교 가부시기가이샤 전자부품의 실장방법
US4831696A (en) * 1988-05-06 1989-05-23 American Telephone And Telegraph Company Component insertion machine apparatus
JPH01295500A (ja) * 1988-05-24 1989-11-29 Taiyo Yuden Co Ltd チップ状電子部品マウント方法及びその装置
US4941795A (en) * 1988-11-21 1990-07-17 At&T Bell Laboratories Component insertion machine apparatus
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
JP2566042B2 (ja) * 1990-05-21 1996-12-25 株式会社東芝 光半導体製造装置
US5105368A (en) * 1990-08-01 1992-04-14 At&T Bell Laboratories Method for improving robot accuracy
JP3459840B2 (ja) * 1992-09-18 2003-10-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ワークピース挿入装置
JP3680359B2 (ja) * 1995-07-04 2005-08-10 株式会社デンソー 電子部品の配列方法
JPH09289371A (ja) * 1996-04-22 1997-11-04 Sony Corp 手動式電子部品装着装置及び方法
US5779846A (en) * 1997-03-25 1998-07-14 Fan; Kan-Tsang Machine for embedding copper nuts in a workpiece
US5932065A (en) * 1997-04-10 1999-08-03 Mcms, Inc. Universal fixture for supporting and holding populated sides of printed circuit board assemblies during processing
TW417411B (en) * 1997-05-16 2001-01-01 Sony Corp Apparatus and method for mounting electronic parts
US5916513A (en) * 1997-08-04 1999-06-29 Motorola Method and apparatus for affixing components to a substrate when a manufacturing line ceases operation
US6251219B1 (en) 1998-09-17 2001-06-26 Intermedics Inc. Method and apparatus for use in assembling electronic devices
US6505665B1 (en) 1998-09-17 2003-01-14 Intermedics, Inc. Method and apparatus for use in assembling electronic devices
US6945151B1 (en) * 1998-10-20 2005-09-20 Micron Technology, Inc. Integrated circuit package separators
US6277671B1 (en) * 1998-10-20 2001-08-21 Micron Technology, Inc. Methods of forming integrated circuit packages
JP3588444B2 (ja) * 2000-10-26 2004-11-10 松下電器産業株式会社 電子部品、部品実装装置及び部品実装方法
IL161392A0 (en) * 2001-10-19 2004-09-27 Monogen Inc Mutomated system and method for processing specimens to extract samples for both liquid-based and sleide-based testing
US7886430B2 (en) * 2002-12-13 2011-02-15 Hewlett-Packard Development Company, L.P. Method of installing circuit board component
JP3833997B2 (ja) * 2002-12-17 2006-10-18 オリオン電機株式会社 プリント回路板の製造方法
US6966551B2 (en) * 2003-03-27 2005-11-22 Sogotec Enterprise Co., Ltd. Unloading apparatus for plate-like workpiece cutting machine
US8297472B2 (en) * 2010-11-24 2012-10-30 Texas Instruments Incorporated Pellet loader with pellet separator for molding IC devices
US9545695B2 (en) 2013-03-15 2017-01-17 Hvac Inventors/Systemation, Inc. Apparatus and method for placement of angle plates in transverse duct flanges
CA3014579C (en) 2013-03-15 2020-07-07 Hvac Inventors/Systemation, Inc. Sleeve for angle plates of transverse duct flanges
US9027376B2 (en) 2013-06-04 2015-05-12 Hvac Inventors/Systemation, Inc. Apparatus and method for inserting angle plates and closing duct seams
US10271437B2 (en) 2014-08-14 2019-04-23 The United States Of America As Represented By The Secretary Of The Army Motion-based reconfigurable microelectronics system
CN111511125B (zh) * 2020-04-27 2021-10-15 Oppo（重庆）智能科技有限公司 用于usb座与fpc焊接过程中的压合设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1746988A (en) * 1927-04-08 1930-02-11 Mcdonald Engineering Corp Labeling machine
US1946878A (en) * 1931-11-03 1934-02-13 Pazziani Auguste Process and apparatus for constructing fabric pattern cards
US3600246A (en) * 1968-05-17 1971-08-17 Rca Corp Method of making laminated semiconductor devices
DE1805174A1 (de) * 1968-10-25 1970-05-14 Telefunken Patent Verfahren zum Aufbringen von Einzelkoerpern auf einen Grundkoerper
US3710479A (en) * 1971-03-01 1973-01-16 Ibm Component insertion apparatus
JPS5031006A (en:Method) * 1973-07-24 1975-03-27

Also Published As

Publication number Publication date
JPS52124168A (en) 1977-10-18
US4127432A (en) 1978-11-28

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