JPS5522816A - Resin sealed electronic parts - Google Patents
Resin sealed electronic partsInfo
- Publication number
- JPS5522816A JPS5522816A JP9460278A JP9460278A JPS5522816A JP S5522816 A JPS5522816 A JP S5522816A JP 9460278 A JP9460278 A JP 9460278A JP 9460278 A JP9460278 A JP 9460278A JP S5522816 A JPS5522816 A JP S5522816A
- Authority
- JP
- Japan
- Prior art keywords
- electronic parts
- powder
- pellets
- active
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thyristors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9460278A JPS5522816A (en) | 1978-08-04 | 1978-08-04 | Resin sealed electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9460278A JPS5522816A (en) | 1978-08-04 | 1978-08-04 | Resin sealed electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5522816A true JPS5522816A (en) | 1980-02-18 |
Family
ID=14114795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9460278A Pending JPS5522816A (en) | 1978-08-04 | 1978-08-04 | Resin sealed electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5522816A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
JPS57195151A (en) * | 1981-05-27 | 1982-11-30 | Denki Kagaku Kogyo Kk | Low-radioactive resin composition |
JPS5836411A (ja) * | 1981-08-26 | 1983-03-03 | Hitachi Ltd | アウトサ−ト成形品 |
JPS6040163A (ja) * | 1983-07-27 | 1985-03-02 | ヘキスト・セラニーズ・コーポレーション | 電子部品の改良封入成形法 |
-
1978
- 1978-08-04 JP JP9460278A patent/JPS5522816A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
JPS6311780B2 (ja) * | 1980-07-04 | 1988-03-16 | Asahi Glass Co Ltd | |
JPS57195151A (en) * | 1981-05-27 | 1982-11-30 | Denki Kagaku Kogyo Kk | Low-radioactive resin composition |
JPS5836411A (ja) * | 1981-08-26 | 1983-03-03 | Hitachi Ltd | アウトサ−ト成形品 |
JPS6241448B2 (ja) * | 1981-08-26 | 1987-09-03 | Hitachi Ltd | |
JPS6040163A (ja) * | 1983-07-27 | 1985-03-02 | ヘキスト・セラニーズ・コーポレーション | 電子部品の改良封入成形法 |
JPH0535189B2 (ja) * | 1983-07-27 | 1993-05-25 | Hoechst Celanese Corp |
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