JPS6431445A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS6431445A
JPS6431445A JP18795687A JP18795687A JPS6431445A JP S6431445 A JPS6431445 A JP S6431445A JP 18795687 A JP18795687 A JP 18795687A JP 18795687 A JP18795687 A JP 18795687A JP S6431445 A JPS6431445 A JP S6431445A
Authority
JP
Japan
Prior art keywords
resin
ketons
temperature
sealing material
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18795687A
Other languages
Japanese (ja)
Inventor
Osamu Nakagawa
Tatsuhiko Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18795687A priority Critical patent/JPS6431445A/en
Publication of JPS6431445A publication Critical patent/JPS6431445A/en
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a resin moldings having stability without void and reliability by uniformly dispersing in advance ketons having 95 deg.C or more of boiling point and set to a temperature or less by adding 20 deg.C to the temperature of set metal molds in a thermosetting resin sealing material, and employing the material. CONSTITUTION:Ketons having 95 deg.C or more of boiling point and set to a temperature or less by adding 20 deg.C to set metal molds 1, 2 are mixed in advance uniformly in the step of mixing powder for forming the sealing material or heating, melting and kneading the powder as a thermosetting resin sealing material used for a resin sealed semiconductor device manufactured by transfer molding, the ketons are volatilized at the time of molding, the volatilized vapor is substituted for air to improve the compression ratio by the transfer pressure, thereby eliminating voids 8 appearing in the outside or the inside of a resin moldings.
JP18795687A 1987-07-27 1987-07-27 Resin-sealed semiconductor device Pending JPS6431445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18795687A JPS6431445A (en) 1987-07-27 1987-07-27 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18795687A JPS6431445A (en) 1987-07-27 1987-07-27 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS6431445A true JPS6431445A (en) 1989-02-01

Family

ID=16215107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18795687A Pending JPS6431445A (en) 1987-07-27 1987-07-27 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS6431445A (en)

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