JPS55165653A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55165653A
JPS55165653A JP7411479A JP7411479A JPS55165653A JP S55165653 A JPS55165653 A JP S55165653A JP 7411479 A JP7411479 A JP 7411479A JP 7411479 A JP7411479 A JP 7411479A JP S55165653 A JPS55165653 A JP S55165653A
Authority
JP
Japan
Prior art keywords
recess
ring
metalized
electrodes
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7411479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6214096B2 (enrdf_load_stackoverflow
Inventor
Kazuo Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7411479A priority Critical patent/JPS55165653A/ja
Publication of JPS55165653A publication Critical patent/JPS55165653A/ja
Publication of JPS6214096B2 publication Critical patent/JPS6214096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP7411479A 1979-06-12 1979-06-12 Semiconductor device Granted JPS55165653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7411479A JPS55165653A (en) 1979-06-12 1979-06-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7411479A JPS55165653A (en) 1979-06-12 1979-06-12 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55165653A true JPS55165653A (en) 1980-12-24
JPS6214096B2 JPS6214096B2 (enrdf_load_stackoverflow) 1987-03-31

Family

ID=13537844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7411479A Granted JPS55165653A (en) 1979-06-12 1979-06-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55165653A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849443U (ja) * 1981-09-26 1983-04-04 三菱電機株式会社 半導体装置用パツケ−ジ
JPH03119227A (ja) * 1989-09-30 1991-05-21 Iseki & Co Ltd 小型ショベルカーに於ける油圧操作レバーのロック装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278683A (ja) * 1988-04-28 1989-11-09 Yoshihiro Yonahara はしご

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4925822U (enrdf_load_stackoverflow) * 1972-06-08 1974-03-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4925822U (enrdf_load_stackoverflow) * 1972-06-08 1974-03-05

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849443U (ja) * 1981-09-26 1983-04-04 三菱電機株式会社 半導体装置用パツケ−ジ
JPH03119227A (ja) * 1989-09-30 1991-05-21 Iseki & Co Ltd 小型ショベルカーに於ける油圧操作レバーのロック装置

Also Published As

Publication number Publication date
JPS6214096B2 (enrdf_load_stackoverflow) 1987-03-31

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