JPS5516459A - Taper etching method - Google Patents

Taper etching method

Info

Publication number
JPS5516459A
JPS5516459A JP8955878A JP8955878A JPS5516459A JP S5516459 A JPS5516459 A JP S5516459A JP 8955878 A JP8955878 A JP 8955878A JP 8955878 A JP8955878 A JP 8955878A JP S5516459 A JPS5516459 A JP S5516459A
Authority
JP
Japan
Prior art keywords
etching
layer
pattern
ion beam
placed beyond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8955878A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63944B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Hiroshi Gokan
Yoshimasa Kato
Sotaro Edokoro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8955878A priority Critical patent/JPS5516459A/ja
Publication of JPS5516459A publication Critical patent/JPS5516459A/ja
Publication of JPS63944B2 publication Critical patent/JPS63944B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
JP8955878A 1978-07-21 1978-07-21 Taper etching method Granted JPS5516459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8955878A JPS5516459A (en) 1978-07-21 1978-07-21 Taper etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8955878A JPS5516459A (en) 1978-07-21 1978-07-21 Taper etching method

Publications (2)

Publication Number Publication Date
JPS5516459A true JPS5516459A (en) 1980-02-05
JPS63944B2 JPS63944B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-01-09

Family

ID=13974141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8955878A Granted JPS5516459A (en) 1978-07-21 1978-07-21 Taper etching method

Country Status (1)

Country Link
JP (1) JPS5516459A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105655231A (zh) * 2014-11-13 2016-06-08 北京北方微电子基地设备工艺研究中心有限责任公司 一种刻蚀用掩膜组及应用其的衬底刻蚀方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1007908A3 (nl) * 1993-12-24 1995-11-14 Philips Electronics Nv Beeldweergave-inrichting met afbuigeenheid en afbuigeenheid voor een beeldweergave-inrichting.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105655231A (zh) * 2014-11-13 2016-06-08 北京北方微电子基地设备工艺研究中心有限责任公司 一种刻蚀用掩膜组及应用其的衬底刻蚀方法

Also Published As

Publication number Publication date
JPS63944B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-01-09

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