JPS5516449A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5516449A
JPS5516449A JP8945378A JP8945378A JPS5516449A JP S5516449 A JPS5516449 A JP S5516449A JP 8945378 A JP8945378 A JP 8945378A JP 8945378 A JP8945378 A JP 8945378A JP S5516449 A JPS5516449 A JP S5516449A
Authority
JP
Japan
Prior art keywords
base
cap
package
chip
advance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8945378A
Other languages
English (en)
Inventor
Eiji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8945378A priority Critical patent/JPS5516449A/ja
Publication of JPS5516449A publication Critical patent/JPS5516449A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP8945378A 1978-07-24 1978-07-24 Semiconductor device Pending JPS5516449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8945378A JPS5516449A (en) 1978-07-24 1978-07-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8945378A JPS5516449A (en) 1978-07-24 1978-07-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5516449A true JPS5516449A (en) 1980-02-05

Family

ID=13971103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8945378A Pending JPS5516449A (en) 1978-07-24 1978-07-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5516449A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62253675A (ja) * 1986-04-28 1987-11-05 Tatsuta Electric Wire & Cable Co Ltd 導電塗料
JPH0197615U (ja) * 1987-11-26 1989-06-29
JPH0213747U (ja) * 1988-07-08 1990-01-29
JPH0279055U (ja) * 1988-12-07 1990-06-18

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62253675A (ja) * 1986-04-28 1987-11-05 Tatsuta Electric Wire & Cable Co Ltd 導電塗料
JPH0240269B2 (ja) * 1986-04-28 1990-09-11 Tatsuta Densen Kk
JPH0197615U (ja) * 1987-11-26 1989-06-29
JPH0213747U (ja) * 1988-07-08 1990-01-29
JPH0279055U (ja) * 1988-12-07 1990-06-18

Similar Documents

Publication Publication Date Title
US3591839A (en) Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
FR2220879B1 (ja)
JPS5745259A (en) Resin sealing type semiconductor device
EP0169241A4 (en) METHOD FOR FORMING HERMETICALLY CLOSED ELECTRICAL APPLICATION LADDER.
MY117368A (en) A resistor and its manufacturing method
JPS5619639A (en) Semiconductor device
EP0272390A3 (en) Packages for a semiconductor device
JPS5516449A (en) Semiconductor device
JPS56148857A (en) Semiconductor device
JPS57162352A (en) Manufacture of resin-sealed semiconductor device
JPS5512762A (en) Glass sealing type semiconductor device manufacturing method
JPS558057A (en) Semiconductor
JPS5289468A (en) Semiconductor device
JPS6218049Y2 (ja)
JPS5240974A (en) Package for semiconductor chips
JPS5552242A (en) Semiconductor device
JPS6451642A (en) Sealing structure of semiconductor
JPS5561044A (en) Packaging device for semiconductor integrated circuit
JPS5326585A (en) Production of mis semiconductor device
JPS6428855A (en) Package for semiconductor device
JPS553610A (en) Semiconductor device
JPS551530A (en) Moisture detecting method in package cavity
JPS6480058A (en) Semiconductor device
JPS56147454A (en) Packaging structure for semiconductor chip
JPS56133851A (en) Hybrid ic packaging