JPS55163848A - Manufacture of semiconductor device and its manufacturing device - Google Patents
Manufacture of semiconductor device and its manufacturing deviceInfo
- Publication number
- JPS55163848A JPS55163848A JP7093379A JP7093379A JPS55163848A JP S55163848 A JPS55163848 A JP S55163848A JP 7093379 A JP7093379 A JP 7093379A JP 7093379 A JP7093379 A JP 7093379A JP S55163848 A JPS55163848 A JP S55163848A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- valve
- supplied
- high frequency
- frequency induction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
Abstract
PURPOSE:To enable manufacture of a semiconductor device at low temperature in a method of manufacturing an oxide film including halogen elements such as chlorine or the like by activating or decomposing gas including halogen elements with high frequency induction energy, mixing the gas with acidic gas and oxidizing a semiconductor. CONSTITUTION:A semiconductor wafer 1 is placed on a boat 2, which is then installed in a reaction furnace 3. Gas including halogen element is supplied from a valve 11, acidic gas is supplied from a valve 12, inert gas is supplied from a valve 13, and high frequency induction annealing gas (H2, He) is supplied from a valve 18, and mixture gas is supplied from a valve 14 to a reaction furnace 3. The mixture gas is activated or decomposed in a high frequency induction furnace 6, and oxidized in a resistance heating furnace 7, and an oxide film is formed on a semiconductor wafer 1.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7093379A JPS55163848A (en) | 1979-06-06 | 1979-06-06 | Manufacture of semiconductor device and its manufacturing device |
JP2066270A JPH069197B2 (en) | 1979-06-06 | 1990-03-16 | Gate insulating film fabrication method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7093379A JPS55163848A (en) | 1979-06-06 | 1979-06-06 | Manufacture of semiconductor device and its manufacturing device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2066270A Division JPH069197B2 (en) | 1979-06-06 | 1990-03-16 | Gate insulating film fabrication method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55163848A true JPS55163848A (en) | 1980-12-20 |
Family
ID=13445798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7093379A Pending JPS55163848A (en) | 1979-06-06 | 1979-06-06 | Manufacture of semiconductor device and its manufacturing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55163848A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5842239A (en) * | 1981-09-07 | 1983-03-11 | Semiconductor Energy Lab Co Ltd | Plasma oxidization |
JPS62174923A (en) * | 1986-01-29 | 1987-07-31 | Hitachi Ltd | Formation of sheet type thin film and device for the same |
JPH03129736A (en) * | 1979-06-06 | 1991-06-03 | Semiconductor Energy Lab Co Ltd | Manufacture of oxide film |
JPH07130491A (en) * | 1993-10-29 | 1995-05-19 | Nichimen Denshi Koken Kk | Mixed type rf plasma generating device |
JPH07326494A (en) * | 1992-11-04 | 1995-12-12 | Novellus Syst Inc | Plasma process device |
US6607947B1 (en) | 1990-05-29 | 2003-08-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with fluorinated layer for blocking alkali ions |
US7998801B2 (en) | 2008-04-25 | 2011-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor having altered semiconductor layer |
-
1979
- 1979-06-06 JP JP7093379A patent/JPS55163848A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129736A (en) * | 1979-06-06 | 1991-06-03 | Semiconductor Energy Lab Co Ltd | Manufacture of oxide film |
JPH069197B2 (en) * | 1979-06-06 | 1994-02-02 | 株式会社半導体エネルギー研究所 | Gate insulating film fabrication method |
JPS5842239A (en) * | 1981-09-07 | 1983-03-11 | Semiconductor Energy Lab Co Ltd | Plasma oxidization |
JPS62174923A (en) * | 1986-01-29 | 1987-07-31 | Hitachi Ltd | Formation of sheet type thin film and device for the same |
JPH0693452B2 (en) * | 1986-01-29 | 1994-11-16 | 株式会社日立製作所 | Single-wafer thin film forming method and thin film forming apparatus |
US6607947B1 (en) | 1990-05-29 | 2003-08-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with fluorinated layer for blocking alkali ions |
US7355202B2 (en) | 1990-05-29 | 2008-04-08 | Semiconductor Energy Co., Ltd. | Thin-film transistor |
JPH07326494A (en) * | 1992-11-04 | 1995-12-12 | Novellus Syst Inc | Plasma process device |
JPH07130491A (en) * | 1993-10-29 | 1995-05-19 | Nichimen Denshi Koken Kk | Mixed type rf plasma generating device |
US7998801B2 (en) | 2008-04-25 | 2011-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film transistor having altered semiconductor layer |
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