JPS55162288A - Manufacture of buried type photosemiconductor device - Google Patents
Manufacture of buried type photosemiconductor deviceInfo
- Publication number
- JPS55162288A JPS55162288A JP7033079A JP7033079A JPS55162288A JP S55162288 A JPS55162288 A JP S55162288A JP 7033079 A JP7033079 A JP 7033079A JP 7033079 A JP7033079 A JP 7033079A JP S55162288 A JPS55162288 A JP S55162288A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- buried
- lamination
- type
- optical guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/06—LPE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Weting (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
PURPOSE:To obtain a high performance of buried type photosemiconductor device by a method wherein a striped lamination of InP and In1-xGaxAs1-yPy is formed through chemical etching, and after melt-back treating by means of an unsaturated solution of In which contains As, an epitaxial layer is buried therein. CONSTITUTION:A lamination 6 is obtained through placing N-type InP optical guide layer 2, In1-xGaxAs1-yPy active layer 3, P-type InP optical guide layer 4, P-type In1-zGazAs1-wPw cap layer 5 on an N-type InP substrate 1. With a mask 7 applied thereon, it is etched as deep as the layer 4 by means of 5% Br methanol, and then subjected to metl-back treating as far as the optical guide layer 2 by means of an unsaturated solution of In containing As at 10-30%, thus forming a lamination 6'. Next, P-layer and N-layer are laminated through liquid phase epitaxial process, and the lamination 6' is buried therein. The mask 7 is removed, and an electrode 10 and a heat sink 9 are applied. According to this constitution, there is no surface level produced between active layer 3' and epitaxial layer 8, thus obtaining a high performance of buried photosemiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7033079A JPS55162288A (en) | 1979-06-04 | 1979-06-04 | Manufacture of buried type photosemiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7033079A JPS55162288A (en) | 1979-06-04 | 1979-06-04 | Manufacture of buried type photosemiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55162288A true JPS55162288A (en) | 1980-12-17 |
JPS5640996B2 JPS5640996B2 (en) | 1981-09-25 |
Family
ID=13428304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7033079A Granted JPS55162288A (en) | 1979-06-04 | 1979-06-04 | Manufacture of buried type photosemiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55162288A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5662386A (en) * | 1979-10-29 | 1981-05-28 | Hitachi Ltd | Manufacture of semiconductor device |
FR2517485A1 (en) * | 1981-12-01 | 1983-06-03 | Itt | METHOD OF MANUFACTURING SEMICONDUCTOR LASERS |
JPS58157188A (en) * | 1982-02-24 | 1983-09-19 | プレツシ−・オ−バ−シ−ズ・リミテツド | Semiconductor laser |
US4963507A (en) * | 1987-04-30 | 1990-10-16 | Siemens Aktiengesellschaft | Method and manufacturing a laser diode with buried active layer |
EP0713275A1 (en) * | 1994-11-19 | 1996-05-22 | Lg Electronics Inc. | Method for fabricating a semiconductor laser diode |
WO2006004255A1 (en) * | 2004-03-23 | 2006-01-12 | Postech Academy-Industry Foundation | ETCHANT FOR WET ETCHING AlXGaI-XAs EPITAXIAL LAYER AND METHOD FOR MANUFACTURING SEMI¬ CONDUCTOR DEVICE USING THE ETCHANT |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015137373A1 (en) * | 2014-03-11 | 2017-04-06 | 古河電気工業株式会社 | Semiconductor device |
-
1979
- 1979-06-04 JP JP7033079A patent/JPS55162288A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5662386A (en) * | 1979-10-29 | 1981-05-28 | Hitachi Ltd | Manufacture of semiconductor device |
JPS6361793B2 (en) * | 1979-10-29 | 1988-11-30 | ||
FR2517485A1 (en) * | 1981-12-01 | 1983-06-03 | Itt | METHOD OF MANUFACTURING SEMICONDUCTOR LASERS |
JPS58157188A (en) * | 1982-02-24 | 1983-09-19 | プレツシ−・オ−バ−シ−ズ・リミテツド | Semiconductor laser |
US4963507A (en) * | 1987-04-30 | 1990-10-16 | Siemens Aktiengesellschaft | Method and manufacturing a laser diode with buried active layer |
EP0713275A1 (en) * | 1994-11-19 | 1996-05-22 | Lg Electronics Inc. | Method for fabricating a semiconductor laser diode |
JPH0927654A (en) * | 1994-11-19 | 1997-01-28 | Lg Electron Inc | Manufacture of semiconductor laser diode |
WO2006004255A1 (en) * | 2004-03-23 | 2006-01-12 | Postech Academy-Industry Foundation | ETCHANT FOR WET ETCHING AlXGaI-XAs EPITAXIAL LAYER AND METHOD FOR MANUFACTURING SEMI¬ CONDUCTOR DEVICE USING THE ETCHANT |
Also Published As
Publication number | Publication date |
---|---|
JPS5640996B2 (en) | 1981-09-25 |
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