JPS55162284A - Light emitting diode and its manufacturing method - Google Patents
Light emitting diode and its manufacturing methodInfo
- Publication number
- JPS55162284A JPS55162284A JP6964679A JP6964679A JPS55162284A JP S55162284 A JPS55162284 A JP S55162284A JP 6964679 A JP6964679 A JP 6964679A JP 6964679 A JP6964679 A JP 6964679A JP S55162284 A JPS55162284 A JP S55162284A
- Authority
- JP
- Japan
- Prior art keywords
- concavity
- electrode
- gaas
- curvature
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54069646A JPS5932073B2 (ja) | 1979-06-01 | 1979-06-01 | 発光ダイオ−ドおよびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54069646A JPS5932073B2 (ja) | 1979-06-01 | 1979-06-01 | 発光ダイオ−ドおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55162284A true JPS55162284A (en) | 1980-12-17 |
JPS5932073B2 JPS5932073B2 (ja) | 1984-08-06 |
Family
ID=13408810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54069646A Expired JPS5932073B2 (ja) | 1979-06-01 | 1979-06-01 | 発光ダイオ−ドおよびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5932073B2 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5990964A (ja) * | 1982-11-16 | 1984-05-25 | Nec Corp | 光検出器 |
US5349211A (en) * | 1992-03-26 | 1994-09-20 | Nec Corporation | Semiconductor infrared emitting device with oblique side surface with respect to the cleavage |
US5491350A (en) * | 1993-06-30 | 1996-02-13 | Hitachi Cable Ltd. | Light emitting diode and process for fabricating the same |
FR2809534A1 (fr) * | 2000-05-26 | 2001-11-30 | Commissariat Energie Atomique | Dispositif semiconducteur a injection electronique verticale et son procede de fabrication |
EP1221722A1 (en) * | 2001-01-06 | 2002-07-10 | Interuniversitair Microelektronica Centrum Vzw | Highly efficient paraboloid light emitting diode |
EP1221725A1 (en) * | 2001-01-04 | 2002-07-10 | Interuniversitair Microelektronica Centrum Vzw | Highly efficient paraboloid light emitting diode |
KR100641516B1 (ko) | 2003-09-25 | 2006-11-01 | 세이코 엡슨 가부시키가이샤 | 고체 발광 소자와 그 제조 방법 및 프로젝터 |
EP1744375A1 (de) * | 2005-07-14 | 2007-01-17 | Osram Opto Semiconductors GmbH | Optoelektronischer Chip und Herstellungsverfahren dafür |
CN102412356A (zh) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | 外延基板 |
-
1979
- 1979-06-01 JP JP54069646A patent/JPS5932073B2/ja not_active Expired
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5990964A (ja) * | 1982-11-16 | 1984-05-25 | Nec Corp | 光検出器 |
JPH0562472B2 (ja) * | 1982-11-16 | 1993-09-08 | Nippon Electric Co | |
US5349211A (en) * | 1992-03-26 | 1994-09-20 | Nec Corporation | Semiconductor infrared emitting device with oblique side surface with respect to the cleavage |
US5491350A (en) * | 1993-06-30 | 1996-02-13 | Hitachi Cable Ltd. | Light emitting diode and process for fabricating the same |
FR2809534A1 (fr) * | 2000-05-26 | 2001-11-30 | Commissariat Energie Atomique | Dispositif semiconducteur a injection electronique verticale et son procede de fabrication |
EP1221725A1 (en) * | 2001-01-04 | 2002-07-10 | Interuniversitair Microelektronica Centrum Vzw | Highly efficient paraboloid light emitting diode |
EP1221722A1 (en) * | 2001-01-06 | 2002-07-10 | Interuniversitair Microelektronica Centrum Vzw | Highly efficient paraboloid light emitting diode |
KR100641516B1 (ko) | 2003-09-25 | 2006-11-01 | 세이코 엡슨 가부시키가이샤 | 고체 발광 소자와 그 제조 방법 및 프로젝터 |
EP1744375A1 (de) * | 2005-07-14 | 2007-01-17 | Osram Opto Semiconductors GmbH | Optoelektronischer Chip und Herstellungsverfahren dafür |
US7663150B2 (en) | 2005-07-14 | 2010-02-16 | Osram Opto Semiconductors Gmbh | Optoelectronic chip |
CN102412356A (zh) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | 外延基板 |
Also Published As
Publication number | Publication date |
---|---|
JPS5932073B2 (ja) | 1984-08-06 |
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