JPS55162279A - Manufacture of silicon avalanche photodiode - Google Patents

Manufacture of silicon avalanche photodiode

Info

Publication number
JPS55162279A
JPS55162279A JP6964479A JP6964479A JPS55162279A JP S55162279 A JPS55162279 A JP S55162279A JP 6964479 A JP6964479 A JP 6964479A JP 6964479 A JP6964479 A JP 6964479A JP S55162279 A JPS55162279 A JP S55162279A
Authority
JP
Japan
Prior art keywords
layer
poly
diffusion
oxidized film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6964479A
Other languages
Japanese (ja)
Inventor
Seiichi Nagai
Kazuhisa Takahashi
Saburo Takamiya
Wataru Suzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6964479A priority Critical patent/JPS55162279A/en
Publication of JPS55162279A publication Critical patent/JPS55162279A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/107Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To obtain a perfect planar type avalanche diode by a method wherein diffusion is carried out through a poly-Si which is kept buried in a mesa groove, and an N<+>-layer is formed on the mesa slope. CONSTITUTION:A P-epitaxial layer is placed on an N<+>-type Si substrate to form a mesa groove with an oxidized film 4 as a mask, which is covered thick with a poly-Si 11. The surface is wrapped up to the oxidized film 4, and diffusion is carried out through poly-Si 11 to make an N<+>-layer 8 on the mesa groove slope. Diffusion speed of an impurity in poly-Si is remarkably faster than in a single crystal Si, therefore the layer 8 becomes thick uniformly, and a terminal 7 of PN-junction is protected under the oxidized film 4. Further in an O2 atmosphere, there is produced an SiO2 film separately on the layer 11, and a diffusion of other impurities is then prevented. Next, a window is provided on the oxidized film 4, a P<+>-layer 3 is formed on the P-layer 2, an electrode 6 and a reflection preventing film 13 are made, thus completing a P-type side incident device. A device good in reproducibility and high in reliability is obtainable in satisfactory yield according to this method.
JP6964479A 1979-06-01 1979-06-01 Manufacture of silicon avalanche photodiode Pending JPS55162279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6964479A JPS55162279A (en) 1979-06-01 1979-06-01 Manufacture of silicon avalanche photodiode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6964479A JPS55162279A (en) 1979-06-01 1979-06-01 Manufacture of silicon avalanche photodiode

Publications (1)

Publication Number Publication Date
JPS55162279A true JPS55162279A (en) 1980-12-17

Family

ID=13408754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6964479A Pending JPS55162279A (en) 1979-06-01 1979-06-01 Manufacture of silicon avalanche photodiode

Country Status (1)

Country Link
JP (1) JPS55162279A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112289882A (en) * 2020-10-30 2021-01-29 无锡中微晶园电子有限公司 Manufacturing method of avalanche photodiode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112289882A (en) * 2020-10-30 2021-01-29 无锡中微晶园电子有限公司 Manufacturing method of avalanche photodiode
CN112289882B (en) * 2020-10-30 2024-06-11 无锡中微晶园电子有限公司 Manufacturing method of avalanche photodiode

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