JPS55160452A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS55160452A
JPS55160452A JP6909079A JP6909079A JPS55160452A JP S55160452 A JPS55160452 A JP S55160452A JP 6909079 A JP6909079 A JP 6909079A JP 6909079 A JP6909079 A JP 6909079A JP S55160452 A JPS55160452 A JP S55160452A
Authority
JP
Japan
Prior art keywords
thin film
film
metal
circuit
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6909079A
Other languages
English (en)
Japanese (ja)
Other versions
JPH029453B2 (enExample
Inventor
Takaharu Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6909079A priority Critical patent/JPS55160452A/ja
Publication of JPS55160452A publication Critical patent/JPS55160452A/ja
Publication of JPH029453B2 publication Critical patent/JPH029453B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Die Bonding (AREA)
JP6909079A 1979-06-01 1979-06-01 Hybrid integrated circuit Granted JPS55160452A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6909079A JPS55160452A (en) 1979-06-01 1979-06-01 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6909079A JPS55160452A (en) 1979-06-01 1979-06-01 Hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS55160452A true JPS55160452A (en) 1980-12-13
JPH029453B2 JPH029453B2 (enExample) 1990-03-02

Family

ID=13392540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6909079A Granted JPS55160452A (en) 1979-06-01 1979-06-01 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS55160452A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235551A (ja) * 1985-08-08 1987-02-16 Nec Corp 混成集積回路の定電流源回路
WO2004066697A1 (ja) * 2003-01-20 2004-08-05 Fujikura Ltd. 多層配線板およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4814766U (enExample) * 1971-07-02 1973-02-19
JPS5455268U (enExample) * 1977-09-27 1979-04-17

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4814766U (enExample) * 1971-07-02 1973-02-19
JPS5455268U (enExample) * 1977-09-27 1979-04-17

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235551A (ja) * 1985-08-08 1987-02-16 Nec Corp 混成集積回路の定電流源回路
WO2004066697A1 (ja) * 2003-01-20 2004-08-05 Fujikura Ltd. 多層配線板およびその製造方法
US7886438B2 (en) 2003-01-20 2011-02-15 Fujikura Ltd. Process for producing multilayer printed wiring board

Also Published As

Publication number Publication date
JPH029453B2 (enExample) 1990-03-02

Similar Documents

Publication Publication Date Title
GB1080618A (en) Hybrid semiconductor circuits
JPS5618448A (en) Composite electronic part
JPS55160452A (en) Hybrid integrated circuit
JPS575356A (en) Hybrid integrated circuit device
JPS57130443A (en) Substrate for hybrid integrated circuit
JPS6464298A (en) Hybrid integrated circuit
JPS5643746A (en) Lead-less hybrid integrated circuit parts
JPS5742138A (en) Semiconductor device
JPS556852A (en) Semiconductor device
JPS54109769A (en) Semiconductor device connecting tape
JPS5546561A (en) Method of fabricating hybrid integrated circuit
JPS57202747A (en) Electronic circuit device
JPS5552231A (en) Semiconductor attaching device
JPS5318962A (en) Semiconductor package
JPS556862A (en) Mounting structure of ic for electronic timepiece
JPS5715435A (en) Substrate for semiconductor device
JPS5414159A (en) Manufacture for semiconductor device
JPS6444027A (en) Semiconductor device
JPS5267966A (en) Manufacture of semiconductor unit
JPS57154844A (en) Semiconductor element
JPS52127184A (en) Semiconductor integrated circuit
JPS5322366A (en) Electronic part
JPS55121661A (en) Manufacture of package
JPS6444092A (en) Wiring substrate
JPS6457795A (en) Manufacture of thick film circuit device