JPS5455268U - - Google Patents
Info
- Publication number
- JPS5455268U JPS5455268U JP1977129516U JP12951677U JPS5455268U JP S5455268 U JPS5455268 U JP S5455268U JP 1977129516 U JP1977129516 U JP 1977129516U JP 12951677 U JP12951677 U JP 12951677U JP S5455268 U JPS5455268 U JP S5455268U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977129516U JPS5455268U (enExample) | 1977-09-27 | 1977-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977129516U JPS5455268U (enExample) | 1977-09-27 | 1977-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5455268U true JPS5455268U (enExample) | 1979-04-17 |
Family
ID=29094247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977129516U Pending JPS5455268U (enExample) | 1977-09-27 | 1977-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5455268U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55160452A (en) * | 1979-06-01 | 1980-12-13 | Nec Corp | Hybrid integrated circuit |
| JPH027534A (ja) * | 1988-06-27 | 1990-01-11 | Fujitsu Ltd | 半導体装置 |
| JP2014187180A (ja) * | 2013-03-22 | 2014-10-02 | Mitsubishi Materials Corp | 半導体装置用接合体、パワーモジュール用基板及びパワーモジュール |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS506144A (enExample) * | 1973-05-18 | 1975-01-22 | ||
| JPS5132358U (enExample) * | 1974-08-30 | 1976-03-09 |
-
1977
- 1977-09-27 JP JP1977129516U patent/JPS5455268U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS506144A (enExample) * | 1973-05-18 | 1975-01-22 | ||
| JPS5132358U (enExample) * | 1974-08-30 | 1976-03-09 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55160452A (en) * | 1979-06-01 | 1980-12-13 | Nec Corp | Hybrid integrated circuit |
| JPH027534A (ja) * | 1988-06-27 | 1990-01-11 | Fujitsu Ltd | 半導体装置 |
| JP2014187180A (ja) * | 2013-03-22 | 2014-10-02 | Mitsubishi Materials Corp | 半導体装置用接合体、パワーモジュール用基板及びパワーモジュール |