JPS55156339A - Forming method of bump electrode - Google Patents
Forming method of bump electrodeInfo
- Publication number
- JPS55156339A JPS55156339A JP6389779A JP6389779A JPS55156339A JP S55156339 A JPS55156339 A JP S55156339A JP 6389779 A JP6389779 A JP 6389779A JP 6389779 A JP6389779 A JP 6389779A JP S55156339 A JPS55156339 A JP S55156339A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electrode
- film
- layer
- bump electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6389779A JPS55156339A (en) | 1979-05-25 | 1979-05-25 | Forming method of bump electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6389779A JPS55156339A (en) | 1979-05-25 | 1979-05-25 | Forming method of bump electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55156339A true JPS55156339A (en) | 1980-12-05 |
Family
ID=13242545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6389779A Pending JPS55156339A (en) | 1979-05-25 | 1979-05-25 | Forming method of bump electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55156339A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950623A (en) * | 1988-08-02 | 1990-08-21 | Microelectronics Center Of North Carolina | Method of building solder bumps |
US5046161A (en) * | 1988-02-23 | 1991-09-03 | Nec Corporation | Flip chip type semiconductor device |
JPH0422131A (ja) * | 1990-05-17 | 1992-01-27 | Sharp Corp | 半導体装置の製造方法 |
US5289631A (en) * | 1992-03-04 | 1994-03-01 | Mcnc | Method for testing, burn-in, and/or programming of integrated circuit chips |
JPH0682965U (ja) * | 1993-05-18 | 1994-11-29 | アソール株式会社 | シート状乾燥材を備えた寝具 |
US5767010A (en) * | 1995-03-20 | 1998-06-16 | Mcnc | Solder bump fabrication methods and structure including a titanium barrier layer |
-
1979
- 1979-05-25 JP JP6389779A patent/JPS55156339A/ja active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5046161A (en) * | 1988-02-23 | 1991-09-03 | Nec Corporation | Flip chip type semiconductor device |
US4950623A (en) * | 1988-08-02 | 1990-08-21 | Microelectronics Center Of North Carolina | Method of building solder bumps |
JPH0422131A (ja) * | 1990-05-17 | 1992-01-27 | Sharp Corp | 半導体装置の製造方法 |
US5289631A (en) * | 1992-03-04 | 1994-03-01 | Mcnc | Method for testing, burn-in, and/or programming of integrated circuit chips |
US5374893A (en) * | 1992-03-04 | 1994-12-20 | Mcnc | Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
US5381946A (en) * | 1992-03-04 | 1995-01-17 | Mcnc | Method of forming differing volume solder bumps |
JPH0682965U (ja) * | 1993-05-18 | 1994-11-29 | アソール株式会社 | シート状乾燥材を備えた寝具 |
US5767010A (en) * | 1995-03-20 | 1998-06-16 | Mcnc | Solder bump fabrication methods and structure including a titanium barrier layer |
US6222279B1 (en) | 1995-03-20 | 2001-04-24 | Mcnc | Solder bump fabrication methods and structures including a titanium barrier layer |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57143838A (en) | Manufacture of semiconductor device | |
JPS55156339A (en) | Forming method of bump electrode | |
JPS5249772A (en) | Process for production of semiconductor device | |
JPS5649543A (en) | Method for forming solder bump | |
JPS56114358A (en) | Semiconductor device and manufacture | |
JPS5524414A (en) | Electrode forming process | |
JPS5457957A (en) | Production of semiconductor device | |
JPS57154858A (en) | Method for formation of electrode | |
JPS56105653A (en) | Gold bump forming method of semiconductor device | |
JPS60120540A (ja) | バンプ電極の形成方法 | |
JPS56105670A (en) | Semiconductor device | |
JPS5660025A (en) | Bonding method for semiconductor element | |
JPS6412554A (en) | Manufacture of semiconductor device | |
JPS54134975A (en) | Connection method of semiconductor device | |
JPS5785247A (en) | Formation of fetch electrode | |
JPS5460557A (en) | Solder electrode forming method | |
JPS5376752A (en) | Production of semionductor device | |
JPS57141932A (en) | Semiconductor device | |
JPS5515246A (en) | Bonding method for semiconductor substrate | |
JPS5522853A (en) | Manufacturing method of semiconductor device | |
JPS5466091A (en) | Formation method of conductive path of semiconductor device | |
JPS5655063A (en) | Formation of solder bump | |
JPS5734347A (en) | Manufacture of semiconductor device | |
KR940022762A (ko) | 반도체소자의 범프형성방법 | |
JPS57152146A (en) | Manufacture of semiconductor device |