JPS5515216A - Printed circut copper foil and method of manufacturing same - Google Patents

Printed circut copper foil and method of manufacturing same

Info

Publication number
JPS5515216A
JPS5515216A JP8777878A JP8777878A JPS5515216A JP S5515216 A JPS5515216 A JP S5515216A JP 8777878 A JP8777878 A JP 8777878A JP 8777878 A JP8777878 A JP 8777878A JP S5515216 A JPS5515216 A JP S5515216A
Authority
JP
Japan
Prior art keywords
copper foil
manufacturing same
printed circut
circut
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8777878A
Other languages
English (en)
Other versions
JPS6152240B2 (ja
Inventor
Kouji Himuro
Takashi Katou
Nobuo Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MITSUI ANAKONDA DOHAKU KK
Original Assignee
MITSUI ANAKONDA DOHAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MITSUI ANAKONDA DOHAKU KK filed Critical MITSUI ANAKONDA DOHAKU KK
Priority to JP8777878A priority Critical patent/JPS5515216A/ja
Priority to DE2928942A priority patent/DE2928942C2/de
Priority to NL7905675A priority patent/NL7905675A/nl
Priority to GB7925492A priority patent/GB2030176B/en
Priority to SE7906252A priority patent/SE435779B/sv
Priority to IE1383/79A priority patent/IE48597B1/en
Publication of JPS5515216A publication Critical patent/JPS5515216A/ja
Publication of JPS6152240B2 publication Critical patent/JPS6152240B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP8777878A 1978-07-20 1978-07-20 Printed circut copper foil and method of manufacturing same Granted JPS5515216A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP8777878A JPS5515216A (en) 1978-07-20 1978-07-20 Printed circut copper foil and method of manufacturing same
DE2928942A DE2928942C2 (de) 1978-07-20 1979-07-18 Kupferfolie für gedruckte Schaltungen und Verfahren zu deren Herstellung
NL7905675A NL7905675A (nl) 1978-07-20 1979-07-20 Koperfolie voor gedrukte schakelingen alsmede werkwijze ter vervaardiging daarvan.
GB7925492A GB2030176B (en) 1978-07-20 1979-07-20 Copper foil suitable for use in making printed circuits
SE7906252A SE435779B (sv) 1978-07-20 1979-07-20 Skiktbelagd kopparfolie omfattande arsenikhaltigt skikt och sett att framstella folien
IE1383/79A IE48597B1 (en) 1978-07-20 1979-08-08 Copper foil suitable for use in making printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8777878A JPS5515216A (en) 1978-07-20 1978-07-20 Printed circut copper foil and method of manufacturing same

Publications (2)

Publication Number Publication Date
JPS5515216A true JPS5515216A (en) 1980-02-02
JPS6152240B2 JPS6152240B2 (ja) 1986-11-12

Family

ID=13924430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8777878A Granted JPS5515216A (en) 1978-07-20 1978-07-20 Printed circut copper foil and method of manufacturing same

Country Status (6)

Country Link
JP (1) JPS5515216A (ja)
DE (1) DE2928942C2 (ja)
GB (1) GB2030176B (ja)
IE (1) IE48597B1 (ja)
NL (1) NL7905675A (ja)
SE (1) SE435779B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045349A (ja) * 1983-08-23 1985-03-11 馬渕　健一 打ち叩き具駆動回路
WO2010110092A1 (ja) * 2009-03-27 2010-09-30 日鉱金属株式会社 プリント配線板用銅箔及びその製造方法
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551210A (en) * 1984-11-13 1985-11-05 Olin Corporation Dendritic treatment of metallic surfaces for improving adhesive bonding
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
US4647315A (en) * 1985-07-01 1987-03-03 Olin Corporation Copper stainproofing technique
US4961828A (en) * 1989-04-05 1990-10-09 Olin Corporation Treatment of metal foil
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil
US4952285A (en) * 1989-04-14 1990-08-28 Olin Corporation Anti-tarnish treatment of metal foil
US5230932A (en) * 1989-10-13 1993-07-27 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil
US5098796A (en) * 1989-10-13 1992-03-24 Olin Corporation Chromium-zinc anti-tarnish coating on copper foil
US5022968A (en) * 1990-09-20 1991-06-11 Olin Corporation Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
US5164235A (en) * 1990-03-06 1992-11-17 Olin Corporation Anti-tarnish treatment of metal foil
CA2086512A1 (en) * 1990-07-02 1992-01-03 Chung-Yao Chao Rinsing of copper foil after anti-tarnish treatment
US6861159B2 (en) * 1992-03-27 2005-03-01 The Louis Berkman Company Corrosion-resistant coated copper and method for making the same
US5332486A (en) * 1993-01-29 1994-07-26 Gould Electronics Inc. Anti-oxidant coatings for copper foils
JP3292774B2 (ja) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 プリント配線板用銅箔およびその製造方法
KR20000011746A (ko) * 1998-07-17 2000-02-25 미야무라 심뻬이 동박의건조방법및동박건조장치
JP3142259B2 (ja) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
US6342308B1 (en) * 1999-09-29 2002-01-29 Yates Foil Usa, Inc. Copper foil bonding treatment with improved bond strength and resistance to undercutting
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP3670185B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3661763B2 (ja) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3670186B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
US7029761B2 (en) * 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface
JP5400960B2 (ja) * 2010-11-22 2014-01-29 三井金属鉱業株式会社 表面処理銅箔

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4845466A (ja) * 1971-10-08 1973-06-29
JPS4916863A (ja) * 1972-06-12 1974-02-14
JPS4925539A (ja) * 1972-07-04 1974-03-07
JPS5274537A (en) * 1975-12-17 1977-06-22 Mitsui Anakonda Dohaku Kk Surface treating method of copper foil

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2511189C2 (de) * 1975-03-14 1976-10-21 Heinz Bungard Verfahren zur herstellung von oberflaechenplattiertem basismaterial fuer die herstellung von gedruckten schaltungen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4845466A (ja) * 1971-10-08 1973-06-29
JPS4916863A (ja) * 1972-06-12 1974-02-14
JPS4925539A (ja) * 1972-07-04 1974-03-07
JPS5274537A (en) * 1975-12-17 1977-06-22 Mitsui Anakonda Dohaku Kk Surface treating method of copper foil

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045349A (ja) * 1983-08-23 1985-03-11 馬渕　健一 打ち叩き具駆動回路
WO2010110092A1 (ja) * 2009-03-27 2010-09-30 日鉱金属株式会社 プリント配線板用銅箔及びその製造方法
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板

Also Published As

Publication number Publication date
SE435779B (sv) 1984-10-15
SE7906252L (sv) 1980-01-21
IE791383L (en) 1980-01-20
DE2928942A1 (de) 1980-02-07
GB2030176B (en) 1982-10-20
NL7905675A (nl) 1980-01-22
JPS6152240B2 (ja) 1986-11-12
IE48597B1 (en) 1985-03-20
DE2928942C2 (de) 1982-04-08
GB2030176A (en) 1980-04-02

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