JPS5513936A - Printed board and method of manufacturing same - Google Patents
Printed board and method of manufacturing sameInfo
- Publication number
- JPS5513936A JPS5513936A JP8680778A JP8680778A JPS5513936A JP S5513936 A JPS5513936 A JP S5513936A JP 8680778 A JP8680778 A JP 8680778A JP 8680778 A JP8680778 A JP 8680778A JP S5513936 A JPS5513936 A JP S5513936A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- manufacturing same
- manufacturing
- same
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53086807A JPS5854520B2 (en) | 1978-07-18 | 1978-07-18 | Printed board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53086807A JPS5854520B2 (en) | 1978-07-18 | 1978-07-18 | Printed board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5513936A true JPS5513936A (en) | 1980-01-31 |
JPS5854520B2 JPS5854520B2 (en) | 1983-12-05 |
Family
ID=13897069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53086807A Expired JPS5854520B2 (en) | 1978-07-18 | 1978-07-18 | Printed board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5854520B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515248A (en) * | 1978-07-20 | 1980-02-02 | Tamura Kaken Co Ltd | Method of manufacturing printed circuit board |
JPS5524446A (en) * | 1978-08-09 | 1980-02-21 | Ngk Insulators Ltd | Ceramic circuit board |
JPS62219691A (en) * | 1986-03-20 | 1987-09-26 | 富士通株式会社 | Thick film hybrid integrated circuit |
JPS62259500A (en) * | 1986-05-02 | 1987-11-11 | 株式会社東芝 | Circuit board |
JPS63119292A (en) * | 1986-11-07 | 1988-05-23 | 日本電気株式会社 | Multilayer interconnection board |
JPS63155791A (en) * | 1986-12-19 | 1988-06-28 | 日本電気株式会社 | High density multilayer interconnection board |
JPH04267586A (en) * | 1991-02-22 | 1992-09-24 | Nec Corp | Coaxial wiring pattern and formation thereof |
JPH06169175A (en) * | 1992-11-30 | 1994-06-14 | Nec Corp | Multilayer printed wiring board and manufacturing method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50111660U (en) * | 1974-02-22 | 1975-09-11 | ||
JPS5247245U (en) * | 1975-09-30 | 1977-04-04 |
-
1978
- 1978-07-18 JP JP53086807A patent/JPS5854520B2/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50111660U (en) * | 1974-02-22 | 1975-09-11 | ||
JPS5247245U (en) * | 1975-09-30 | 1977-04-04 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515248A (en) * | 1978-07-20 | 1980-02-02 | Tamura Kaken Co Ltd | Method of manufacturing printed circuit board |
JPS5524446A (en) * | 1978-08-09 | 1980-02-21 | Ngk Insulators Ltd | Ceramic circuit board |
JPS62219691A (en) * | 1986-03-20 | 1987-09-26 | 富士通株式会社 | Thick film hybrid integrated circuit |
JPS62259500A (en) * | 1986-05-02 | 1987-11-11 | 株式会社東芝 | Circuit board |
JPS63119292A (en) * | 1986-11-07 | 1988-05-23 | 日本電気株式会社 | Multilayer interconnection board |
JPS63155791A (en) * | 1986-12-19 | 1988-06-28 | 日本電気株式会社 | High density multilayer interconnection board |
JPH04267586A (en) * | 1991-02-22 | 1992-09-24 | Nec Corp | Coaxial wiring pattern and formation thereof |
JPH06169175A (en) * | 1992-11-30 | 1994-06-14 | Nec Corp | Multilayer printed wiring board and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS5854520B2 (en) | 1983-12-05 |
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