JPS55140836A - Pattern forming method - Google Patents
Pattern forming methodInfo
- Publication number
- JPS55140836A JPS55140836A JP4729379A JP4729379A JPS55140836A JP S55140836 A JPS55140836 A JP S55140836A JP 4729379 A JP4729379 A JP 4729379A JP 4729379 A JP4729379 A JP 4729379A JP S55140836 A JPS55140836 A JP S55140836A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- polymer
- layer
- resist
- forming method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To form a pattern with superior resolving power, sensitivity and reproductibility by using a resist layer of specified double layer structure in a pattern forming method by applying radiation after preheating. CONSTITUTION:Second resist layer 2 made of polymer A and first resist layer 1 made of resist polymer B are placed on Si substrate 4 covered with SiO2 layer 3. Acid anhydride bonds formed in polymer B of the upper layer in a preheating process are more than 1.5 times as much as those formed on polymer A of the lower layer. Polymers A, B are prepared by adding a radiolysis type acid such as methacrylic acid having a -COOH group and an acid chloride such as methacrylic acid chloride having a -COCl group, and the furmation rate of acid anhydride bonds is adjusted by varying the ratio of the acid and the acid chloride.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4729379A JPS55140836A (en) | 1979-04-19 | 1979-04-19 | Pattern forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4729379A JPS55140836A (en) | 1979-04-19 | 1979-04-19 | Pattern forming method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55140836A true JPS55140836A (en) | 1980-11-04 |
Family
ID=12771223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4729379A Pending JPS55140836A (en) | 1979-04-19 | 1979-04-19 | Pattern forming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55140836A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395481A (en) * | 1980-09-29 | 1983-07-26 | Siemens Aktiengesellschaft | Method for the manufacture of resist structures |
WO1986001009A1 (en) * | 1984-07-23 | 1986-02-13 | Nippon Telegraph And Telephone Corporation | Pattern formation |
JPS61502079A (en) * | 1984-05-03 | 1986-09-18 | ヒユ−ズ・エアクラフト・カンパニ− | How to apply poly(methacrylic anhydride) resist to semiconductors |
JPH06332181A (en) * | 1993-04-30 | 1994-12-02 | Internatl Business Mach Corp <Ibm> | Resist structure and its preparation |
WO2000010057A1 (en) * | 1998-08-11 | 2000-02-24 | International Business Machines Corporation | Single component developer for copolymer resists |
US6426177B2 (en) | 1998-08-11 | 2002-07-30 | International Business Machines Corporation | Single component developer for use with ghost exposure |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53126273A (en) * | 1977-04-12 | 1978-11-04 | Cho Lsi Gijutsu Kenkyu Kumiai | Method of producing positive pattern |
JPS5432975A (en) * | 1977-08-19 | 1979-03-10 | Agency Of Ind Science & Technol | Formation method of pattern on resist film and resist film |
-
1979
- 1979-04-19 JP JP4729379A patent/JPS55140836A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53126273A (en) * | 1977-04-12 | 1978-11-04 | Cho Lsi Gijutsu Kenkyu Kumiai | Method of producing positive pattern |
JPS5432975A (en) * | 1977-08-19 | 1979-03-10 | Agency Of Ind Science & Technol | Formation method of pattern on resist film and resist film |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395481A (en) * | 1980-09-29 | 1983-07-26 | Siemens Aktiengesellschaft | Method for the manufacture of resist structures |
JPS61502079A (en) * | 1984-05-03 | 1986-09-18 | ヒユ−ズ・エアクラフト・カンパニ− | How to apply poly(methacrylic anhydride) resist to semiconductors |
JPH0150895B2 (en) * | 1984-05-03 | 1989-11-01 | Hughes Aircraft Co | |
WO1986001009A1 (en) * | 1984-07-23 | 1986-02-13 | Nippon Telegraph And Telephone Corporation | Pattern formation |
US4699870A (en) * | 1984-07-23 | 1987-10-13 | Nippon Telegraph And Telephone Corporation | Patterning method |
JPH06332181A (en) * | 1993-04-30 | 1994-12-02 | Internatl Business Mach Corp <Ibm> | Resist structure and its preparation |
WO2000010057A1 (en) * | 1998-08-11 | 2000-02-24 | International Business Machines Corporation | Single component developer for copolymer resists |
US6270949B1 (en) | 1998-08-11 | 2001-08-07 | International Business Machines Corporation | Single component developer for copolymer resists |
US6426177B2 (en) | 1998-08-11 | 2002-07-30 | International Business Machines Corporation | Single component developer for use with ghost exposure |
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