JPS55138272A - Thin film integrated circuit - Google Patents

Thin film integrated circuit

Info

Publication number
JPS55138272A
JPS55138272A JP4465579A JP4465579A JPS55138272A JP S55138272 A JPS55138272 A JP S55138272A JP 4465579 A JP4465579 A JP 4465579A JP 4465579 A JP4465579 A JP 4465579A JP S55138272 A JPS55138272 A JP S55138272A
Authority
JP
Japan
Prior art keywords
electrode
mask
film
integrated circuit
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4465579A
Other languages
Japanese (ja)
Inventor
Isamu Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4465579A priority Critical patent/JPS55138272A/en
Publication of JPS55138272A publication Critical patent/JPS55138272A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To make it easy to fit up or exchange outside attaching parts for a thin film integrated circuit by a method wherein an electrode wall is prepared at a part of circumference of electrode and the scattering of brazing solder is prevented. CONSTITUTION:When outside attaching parts 180, 190 are soldered to pit shape electrodes 220-230, 260-270, the solder does not flow out beyond walls heaped in the pit and the invasion against other circuit elements is prevented. The same effect can be obtained in parts exchanging. To form the pit shape electrode, an Au plating layer 502 is made in an insulating substrate 500. After selective etching using a resisting mask, the mask is removed and Au is attached by evaporation. Then a SiO2 film 503 is attached by evaporation, an opening is made in the film 503 using a resist mask 501 and an electrode wall is formed by lamination of Au. The mask 501 and SiO2 film 503 are removed, and an Au film 502 on the substrate 500 is removed by ion milling to perfect the pit shape electrode.
JP4465579A 1979-04-12 1979-04-12 Thin film integrated circuit Pending JPS55138272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4465579A JPS55138272A (en) 1979-04-12 1979-04-12 Thin film integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4465579A JPS55138272A (en) 1979-04-12 1979-04-12 Thin film integrated circuit

Publications (1)

Publication Number Publication Date
JPS55138272A true JPS55138272A (en) 1980-10-28

Family

ID=12697455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4465579A Pending JPS55138272A (en) 1979-04-12 1979-04-12 Thin film integrated circuit

Country Status (1)

Country Link
JP (1) JPS55138272A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125688A (en) * 1982-12-27 1984-07-20 富士通株式会社 Printed board
JPS6136992A (en) * 1984-07-30 1986-02-21 日本光電工業株式会社 Method of soldering chip part to circuit board
JPH0546115U (en) * 1991-11-12 1993-06-18 株式会社大真空 Surface mount crystal unit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50125762A (en) * 1974-03-20 1975-10-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50125762A (en) * 1974-03-20 1975-10-03

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125688A (en) * 1982-12-27 1984-07-20 富士通株式会社 Printed board
JPS6136992A (en) * 1984-07-30 1986-02-21 日本光電工業株式会社 Method of soldering chip part to circuit board
JPH0546115U (en) * 1991-11-12 1993-06-18 株式会社大真空 Surface mount crystal unit

Similar Documents

Publication Publication Date Title
JPS5626450A (en) Manufacture of semiconductor device
JPS56160740A (en) Manufacture of thin-film field type cold cathode
JPS5637635A (en) Manufacture of semiconductor device
JPS55138272A (en) Thin film integrated circuit
JPS57124431A (en) Manufacture of semiconductor device
JPS5599731A (en) Method of assembling electronic device and lead frame used for assembly
JPS54141585A (en) Semiconductor integrated circuit device
JPS51140565A (en) Semiconductor unit
JPS5750451A (en) Semiconductor
JPS5673450A (en) Manufacture of semiconductor device
JPS55120170A (en) Mos type semiconductor device
JPS5460557A (en) Solder electrode forming method
JPS5268366A (en) Solder vamp formation onto semiconductor substrate
JPS5516425A (en) Semiconductor device
JPS5443466A (en) Electrode formation method for semiconductor device
JPS558090A (en) Semiconductor device
JPS5633858A (en) Manufacture of semiconductor device
JPS5489594A (en) Manufacture for integrated circuit
JPS574156A (en) Semiconductor device
JPS54128670A (en) Manufacture for semiconductor device
JPS56133847A (en) Metal processing
JPS53114365A (en) Manufacture of semiconductor device
JPS53110391A (en) Manufacture of multi-layer wiring for semiconductor device
JPS5398788A (en) Manufacture for semiconductor integrated circuit
JPS5515236A (en) Thin film circuit