JPS55136198A - Epitaxial layer growing method - Google Patents

Epitaxial layer growing method

Info

Publication number
JPS55136198A
JPS55136198A JP4349779A JP4349779A JPS55136198A JP S55136198 A JPS55136198 A JP S55136198A JP 4349779 A JP4349779 A JP 4349779A JP 4349779 A JP4349779 A JP 4349779A JP S55136198 A JPS55136198 A JP S55136198A
Authority
JP
Japan
Prior art keywords
etching
epitaxial layer
press
layer
amt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4349779A
Other languages
Japanese (ja)
Inventor
Hisashi Sawaki
Masahiro Kamiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4349779A priority Critical patent/JPS55136198A/en
Publication of JPS55136198A publication Critical patent/JPS55136198A/en
Pending legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE: To make an etching amt. more uniform as compared to a conventional method and reduce a circuit defect, etc. of a semiconductor device after epitaxial growth by etching a semiconductor single crystal substrate in vapor phase under reduced press. and growing an epitaxial layer under ordinary or elevated press.
CONSTITUTION: When an epitaxial layer is formed on a semiconductor single crystal substrate, after etching the substrate in vapor phase under reduced press. the layer is grown under ordinary or elevated press. By etching the substrate under reduced press. the etching amt. is made more uniform as compared to a conventional method, and a uniform epitaxial layer can be grown. This method is effective in epitaxial growth of a semiconductor device having a buried diffused layer, e.g., a bipolar type semiconductor integrated circuit device, and it prevents a circuit defect, etc. resulting from shallowing of the buried layer due to lack of uniformity in etching amt.
COPYRIGHT: (C)1980,JPO&Japio
JP4349779A 1979-04-10 1979-04-10 Epitaxial layer growing method Pending JPS55136198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4349779A JPS55136198A (en) 1979-04-10 1979-04-10 Epitaxial layer growing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4349779A JPS55136198A (en) 1979-04-10 1979-04-10 Epitaxial layer growing method

Publications (1)

Publication Number Publication Date
JPS55136198A true JPS55136198A (en) 1980-10-23

Family

ID=12665341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4349779A Pending JPS55136198A (en) 1979-04-10 1979-04-10 Epitaxial layer growing method

Country Status (1)

Country Link
JP (1) JPS55136198A (en)

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