JPS55134947A - Pelletizing method of thin film resistor wafer - Google Patents

Pelletizing method of thin film resistor wafer

Info

Publication number
JPS55134947A
JPS55134947A JP4406779A JP4406779A JPS55134947A JP S55134947 A JPS55134947 A JP S55134947A JP 4406779 A JP4406779 A JP 4406779A JP 4406779 A JP4406779 A JP 4406779A JP S55134947 A JPS55134947 A JP S55134947A
Authority
JP
Japan
Prior art keywords
film
layer
etching
resistor
film resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4406779A
Other languages
Japanese (ja)
Inventor
Akiyoshi Nomura
Yoshitaka Yoshikawa
Yasuhiko Horio
Hiroshi Kitazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4406779A priority Critical patent/JPS55134947A/en
Publication of JPS55134947A publication Critical patent/JPS55134947A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To remove pinhole generation in the protective film of a resistor by a method wherein a semiconductor substrate, on which a film resistor and an electrode layer are formed, is covered with protective film, bonding windows and a scribe line are formed using a photo resist layer and pelletized by a roller pressing method. CONSTITUTION:On an Si substrate 11, on which SiO2 film 12 is attached, a film resistor 14 and electrode layers 15 and 15' are formed by vacuum evaporation to be made prescribed-shaped by a photolytic method and an etching method. Next, the whole surface is convered with SiO2 film 16 and thereon a photo resist layer is applied to be made into a prescribed pattern by photo etching. Thereafter, under the mask thereof a scribe-recognizing line 19 and bonding windows 20 and 20' are provided by etching film 16 and a separating cut is formed by dicing the remaining layer 18 along the recognizing line 19 using said layer as protective film for separating cut.
JP4406779A 1979-04-10 1979-04-10 Pelletizing method of thin film resistor wafer Pending JPS55134947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4406779A JPS55134947A (en) 1979-04-10 1979-04-10 Pelletizing method of thin film resistor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4406779A JPS55134947A (en) 1979-04-10 1979-04-10 Pelletizing method of thin film resistor wafer

Publications (1)

Publication Number Publication Date
JPS55134947A true JPS55134947A (en) 1980-10-21

Family

ID=12681275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4406779A Pending JPS55134947A (en) 1979-04-10 1979-04-10 Pelletizing method of thin film resistor wafer

Country Status (1)

Country Link
JP (1) JPS55134947A (en)

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