JPS55134191A - Silver or silver alloy plating bath - Google Patents
Silver or silver alloy plating bathInfo
- Publication number
- JPS55134191A JPS55134191A JP4207680A JP4207680A JPS55134191A JP S55134191 A JPS55134191 A JP S55134191A JP 4207680 A JP4207680 A JP 4207680A JP 4207680 A JP4207680 A JP 4207680A JP S55134191 A JPS55134191 A JP S55134191A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- plating bath
- alloy plating
- silver alloy
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001316 Ag alloy Inorganic materials 0.000 title 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 239000004332 silver Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2717779A | 1979-04-04 | 1979-04-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55134191A true JPS55134191A (en) | 1980-10-18 |
Family
ID=21836140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4207680A Pending JPS55134191A (en) | 1979-04-04 | 1980-04-02 | Silver or silver alloy plating bath |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS55134191A (de) |
AR (1) | AR225759A1 (de) |
AU (1) | AU5717880A (de) |
BR (1) | BR8001854A (de) |
DE (1) | DE3013191A1 (de) |
DK (1) | DK146980A (de) |
FR (1) | FR2453226A1 (de) |
GB (1) | GB2046794A (de) |
IT (1) | IT1127414B (de) |
NL (1) | NL8001999A (de) |
SE (1) | SE8002598L (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH051393A (ja) * | 1990-07-19 | 1993-01-08 | Electroplating Eng Of Japan Co | 銀銅合金メツキ浴及び銀銅合金ロウ材 |
JPH07252684A (ja) * | 1994-02-05 | 1995-10-03 | W C Heraeus Gmbh | 銀−錫合金めっき沈着浴 |
JP2008068400A (ja) * | 1999-12-02 | 2008-03-27 | Nihon Career Ind Co Ltd | 食肉の細断装置 |
CN103741178A (zh) * | 2014-01-20 | 2014-04-23 | 厦门大学 | 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3609309A1 (de) * | 1986-03-20 | 1987-09-24 | Duerrwaechter E Dr Doduco | Bad zum elektrolytischen abscheiden von silber-palladium-legierungen |
DE4406419C1 (de) * | 1994-02-28 | 1995-04-13 | Heraeus Gmbh W C | Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen |
JP2000212763A (ja) * | 1999-01-19 | 2000-08-02 | Shipley Far East Ltd | 銀合金メッキ浴及びそれを用いる銀合金被膜の形成方法 |
US20130023166A1 (en) * | 2011-07-20 | 2013-01-24 | Tyco Electronics Corporation | Silver plated electrical contact |
CN102560571B (zh) * | 2012-02-22 | 2015-08-05 | 江苏大学 | 无氰镀银稳定电镀液、制备方法及其镀银的方法 |
US20160145756A1 (en) * | 2014-11-21 | 2016-05-26 | Rohm And Haas Electronic Materials Llc | Environmentally friendly gold electroplating compositions and methods |
JP7353249B2 (ja) * | 2020-08-19 | 2023-09-29 | Eeja株式会社 | シアン系電解銀合金めっき液 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2410441C2 (de) * | 1974-03-01 | 1982-11-11 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Silber |
JPS52105540A (en) * | 1976-03-01 | 1977-09-05 | Tech Inc | Silver bath for lusterous plating of nonncyanide |
US4088549A (en) * | 1976-04-13 | 1978-05-09 | Oxy Metal Industries Corporation | Bright low karat silver gold electroplating |
US4121982A (en) * | 1978-02-03 | 1978-10-24 | American Chemical & Refining Company Incorporated | Gold alloy plating bath and method |
-
1980
- 1980-03-27 BR BR8001854A patent/BR8001854A/pt unknown
- 1980-04-01 GB GB8010924A patent/GB2046794A/en not_active Withdrawn
- 1980-04-01 AR AR280528A patent/AR225759A1/es active
- 1980-04-02 IT IT48317/80A patent/IT1127414B/it active
- 1980-04-02 DK DK146980A patent/DK146980A/da not_active IP Right Cessation
- 1980-04-02 FR FR8007437A patent/FR2453226A1/fr not_active Withdrawn
- 1980-04-02 JP JP4207680A patent/JPS55134191A/ja active Pending
- 1980-04-03 SE SE8002598A patent/SE8002598L/ not_active Application Discontinuation
- 1980-04-03 DE DE19803013191 patent/DE3013191A1/de not_active Withdrawn
- 1980-04-03 NL NL8001999A patent/NL8001999A/nl not_active Application Discontinuation
- 1980-04-03 AU AU57178/80A patent/AU5717880A/en not_active Abandoned
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH051393A (ja) * | 1990-07-19 | 1993-01-08 | Electroplating Eng Of Japan Co | 銀銅合金メツキ浴及び銀銅合金ロウ材 |
JPH07252684A (ja) * | 1994-02-05 | 1995-10-03 | W C Heraeus Gmbh | 銀−錫合金めっき沈着浴 |
JP2008068400A (ja) * | 1999-12-02 | 2008-03-27 | Nihon Career Ind Co Ltd | 食肉の細断装置 |
CN103741178A (zh) * | 2014-01-20 | 2014-04-23 | 厦门大学 | 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法 |
Also Published As
Publication number | Publication date |
---|---|
AU5717880A (en) | 1980-10-09 |
IT1127414B (it) | 1986-05-21 |
BR8001854A (pt) | 1980-11-18 |
SE8002598L (sv) | 1980-10-05 |
FR2453226A1 (fr) | 1980-10-31 |
DK146980A (da) | 1980-10-05 |
IT8048317A0 (it) | 1980-04-02 |
GB2046794A (en) | 1980-11-19 |
DE3013191A1 (de) | 1980-10-23 |
AR225759A1 (es) | 1982-04-30 |
NL8001999A (nl) | 1980-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2093485B (en) | Electroless alloy plating | |
JPS51149134A (en) | Nonncyanideeseries silver plating bath | |
JPS5460230A (en) | Stabilizing of electroplating bath of tin or tin alloy | |
AU530923B2 (en) | Zinc alloy electroplating bath | |
AU527988B2 (en) | Ni-fe alloy plating bath | |
AU542574B2 (en) | Zinc alloy plating bath | |
GB2047744B (en) | Electrolytic alloy plating | |
JPS55134191A (en) | Silver or silver alloy plating bath | |
JPS5565387A (en) | Chromium alloy electroplating bath | |
JPS5534699A (en) | Silver plating | |
ZA782750B (en) | Alloy plating | |
GB2003504B (en) | Silver electroplating process and baths therefor | |
JPS5380334A (en) | Zinc electroplating bath | |
JPS5420927A (en) | Electroplating of nickelliron alloy | |
JPS53149132A (en) | Golddpalladiummcopper alloy plating liquid | |
JPS5426247A (en) | Golddpalladium alloy plating solution | |
JPS5448646A (en) | Copper electroplating | |
JPS52124428A (en) | Nonnelectrolytic gold plating bath | |
JPS535034A (en) | Neutral electroplating bath for tin or tin alloy | |
JPS52107239A (en) | Cobaltttin alloy plating bath | |
JPS52105540A (en) | Silver bath for lusterous plating of nonncyanide | |
JPS52106331A (en) | Plating bath | |
JPS5469534A (en) | Citric acid brilliant tin or tin alloy plating bath | |
JPS52108341A (en) | Noble metal plating bath | |
JPS53103937A (en) | Ironntungsten alloy plating liquid |