JPS55132083A - Light emitting diode substrate - Google Patents
Light emitting diode substrateInfo
- Publication number
- JPS55132083A JPS55132083A JP3896779A JP3896779A JPS55132083A JP S55132083 A JPS55132083 A JP S55132083A JP 3896779 A JP3896779 A JP 3896779A JP 3896779 A JP3896779 A JP 3896779A JP S55132083 A JPS55132083 A JP S55132083A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- constitution
- led
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3896779A JPS55132083A (en) | 1979-03-30 | 1979-03-30 | Light emitting diode substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3896779A JPS55132083A (en) | 1979-03-30 | 1979-03-30 | Light emitting diode substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55132083A true JPS55132083A (en) | 1980-10-14 |
| JPS6133274B2 JPS6133274B2 (enExample) | 1986-08-01 |
Family
ID=12539922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3896779A Granted JPS55132083A (en) | 1979-03-30 | 1979-03-30 | Light emitting diode substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55132083A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5994381U (ja) * | 1982-12-17 | 1984-06-27 | 株式会社東芝 | 発光表示装置 |
| JPS61116701A (ja) * | 1984-11-12 | 1986-06-04 | 株式会社小糸製作所 | 車輛用灯具 |
| JPS63101987U (enExample) * | 1986-12-22 | 1988-07-02 | ||
| EP1087447A4 (en) * | 1999-03-18 | 2007-03-07 | Rohm Co Ltd | LIGHT EMITTING SEMICONDUCTOR CHIP |
| JP2007129053A (ja) * | 2005-11-02 | 2007-05-24 | Citizen Electronics Co Ltd | Led発光装置。 |
| KR101237685B1 (ko) * | 2011-03-29 | 2013-02-26 | 삼성전기주식회사 | 방열 기판 및 그 제조방법 |
| WO2014083714A1 (ja) | 2012-11-27 | 2014-06-05 | シチズン電子株式会社 | 実装基板及びこの実装基板を用いた発光装置 |
| US10084122B2 (en) | 2014-07-17 | 2018-09-25 | Citizen Electronics Co., Ltd. | Light-emitting apparatus and method of manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61105967U (enExample) * | 1984-12-13 | 1986-07-05 |
-
1979
- 1979-03-30 JP JP3896779A patent/JPS55132083A/ja active Granted
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5994381U (ja) * | 1982-12-17 | 1984-06-27 | 株式会社東芝 | 発光表示装置 |
| JPS61116701A (ja) * | 1984-11-12 | 1986-06-04 | 株式会社小糸製作所 | 車輛用灯具 |
| JPS63101987U (enExample) * | 1986-12-22 | 1988-07-02 | ||
| EP1087447A4 (en) * | 1999-03-18 | 2007-03-07 | Rohm Co Ltd | LIGHT EMITTING SEMICONDUCTOR CHIP |
| JP2007129053A (ja) * | 2005-11-02 | 2007-05-24 | Citizen Electronics Co Ltd | Led発光装置。 |
| KR101237685B1 (ko) * | 2011-03-29 | 2013-02-26 | 삼성전기주식회사 | 방열 기판 및 그 제조방법 |
| WO2014083714A1 (ja) | 2012-11-27 | 2014-06-05 | シチズン電子株式会社 | 実装基板及びこの実装基板を用いた発光装置 |
| US9368707B2 (en) | 2012-11-27 | 2016-06-14 | Citizen Electronics Co., Ltd. | Mounting substrate and light-emitting device using the same |
| JPWO2014083714A1 (ja) * | 2012-11-27 | 2017-01-05 | シチズン電子株式会社 | 実装基板及びこの実装基板を用いた発光装置 |
| US10084122B2 (en) | 2014-07-17 | 2018-09-25 | Citizen Electronics Co., Ltd. | Light-emitting apparatus and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6133274B2 (enExample) | 1986-08-01 |
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