JPS55113349A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55113349A
JPS55113349A JP1983079A JP1983079A JPS55113349A JP S55113349 A JPS55113349 A JP S55113349A JP 1983079 A JP1983079 A JP 1983079A JP 1983079 A JP1983079 A JP 1983079A JP S55113349 A JPS55113349 A JP S55113349A
Authority
JP
Japan
Prior art keywords
substrate
resin
stress
notches
exerted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983079A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6150387B2 (cg-RX-API-DMAC10.html
Inventor
Hiromichi Suzuki
Susumu Okikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1983079A priority Critical patent/JPS55113349A/ja
Priority to US06/096,387 priority patent/US4326215A/en
Priority to GB8005672A priority patent/GB2043343B/en
Priority to DE19803006763 priority patent/DE3006763A1/de
Priority to IT20125/80A priority patent/IT1141373B/it
Publication of JPS55113349A publication Critical patent/JPS55113349A/ja
Publication of JPS6150387B2 publication Critical patent/JPS6150387B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/421—
    • H10W40/778—
    • H10W70/20—
    • H10W70/433—
    • H10W74/114—
    • H10W74/127—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1983079A 1979-02-23 1979-02-23 Semiconductor device Granted JPS55113349A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1983079A JPS55113349A (en) 1979-02-23 1979-02-23 Semiconductor device
US06/096,387 US4326215A (en) 1979-02-23 1979-11-21 Encapsulated semiconductor device with a metallic base plate
GB8005672A GB2043343B (en) 1979-02-23 1980-02-20 Semiconductor device
DE19803006763 DE3006763A1 (de) 1979-02-23 1980-02-22 Halbleiteranordnung
IT20125/80A IT1141373B (it) 1979-02-23 1980-02-22 Dispositivo a semiconduttore

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983079A JPS55113349A (en) 1979-02-23 1979-02-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55113349A true JPS55113349A (en) 1980-09-01
JPS6150387B2 JPS6150387B2 (cg-RX-API-DMAC10.html) 1986-11-04

Family

ID=12010196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983079A Granted JPS55113349A (en) 1979-02-23 1979-02-23 Semiconductor device

Country Status (5)

Country Link
US (1) US4326215A (cg-RX-API-DMAC10.html)
JP (1) JPS55113349A (cg-RX-API-DMAC10.html)
DE (1) DE3006763A1 (cg-RX-API-DMAC10.html)
GB (1) GB2043343B (cg-RX-API-DMAC10.html)
IT (1) IT1141373B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58187172U (ja) * 1982-06-08 1983-12-12 三菱電機株式会社 混成集積回路

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
IT1250405B (it) * 1991-01-31 1995-04-07 Sgs Thomson Microelectronics Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa
KR930009031A (ko) * 1991-10-18 1993-05-22 김광호 반도체 패키지
US5444909A (en) * 1993-12-29 1995-08-29 Intel Corporation Method of making a drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
JP7607430B2 (ja) * 2020-10-12 2024-12-27 株式会社マキタ 作業機

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129379A (en) * 1976-04-23 1977-10-29 Hitachi Ltd Plastic molded semiconductor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
DE1764382A1 (de) * 1967-06-21 1971-07-08 Nippon Denso Co Halbleitergleichrichter
US3679946A (en) * 1970-07-06 1972-07-25 Gen Motors Corp Strip mounted semiconductor device
US3729573A (en) * 1971-01-25 1973-04-24 Motorola Inc Plastic encapsulation of semiconductor devices
US3751724A (en) * 1972-04-28 1973-08-07 C Mcgrath Encapsulated electrical component
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US3786317A (en) * 1972-11-09 1974-01-15 Bell Telephone Labor Inc Microelectronic circuit package
US4125740A (en) * 1973-09-26 1978-11-14 Sgs-Ates Componenti Elettronici S.P.A. Resin-encased microelectronic module
US4048670A (en) * 1975-06-30 1977-09-13 Sprague Electric Company Stress-free hall-cell package
JPS5253665A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Semiconductor device
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129379A (en) * 1976-04-23 1977-10-29 Hitachi Ltd Plastic molded semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58187172U (ja) * 1982-06-08 1983-12-12 三菱電機株式会社 混成集積回路

Also Published As

Publication number Publication date
US4326215A (en) 1982-04-20
JPS6150387B2 (cg-RX-API-DMAC10.html) 1986-11-04
IT8020125A0 (it) 1980-02-22
DE3006763A1 (de) 1980-09-04
GB2043343B (en) 1983-02-02
GB2043343A (en) 1980-10-01
IT1141373B (it) 1986-10-01

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