JPS55110117A - Epoxy resin hardener - Google Patents

Epoxy resin hardener

Info

Publication number
JPS55110117A
JPS55110117A JP1877979A JP1877979A JPS55110117A JP S55110117 A JPS55110117 A JP S55110117A JP 1877979 A JP1877979 A JP 1877979A JP 1877979 A JP1877979 A JP 1877979A JP S55110117 A JPS55110117 A JP S55110117A
Authority
JP
Japan
Prior art keywords
acids
epoxy resin
types
flexibilizing
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1877979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6159327B2 (enrdf_load_stackoverflow
Inventor
Shoji Tani
Yoshihiro Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Chemical Co Ltd
Original Assignee
New Japan Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Chemical Co Ltd filed Critical New Japan Chemical Co Ltd
Priority to JP1877979A priority Critical patent/JPS55110117A/ja
Publication of JPS55110117A publication Critical patent/JPS55110117A/ja
Publication of JPS6159327B2 publication Critical patent/JPS6159327B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
JP1877979A 1979-02-19 1979-02-19 Epoxy resin hardener Granted JPS55110117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1877979A JPS55110117A (en) 1979-02-19 1979-02-19 Epoxy resin hardener

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1877979A JPS55110117A (en) 1979-02-19 1979-02-19 Epoxy resin hardener

Publications (2)

Publication Number Publication Date
JPS55110117A true JPS55110117A (en) 1980-08-25
JPS6159327B2 JPS6159327B2 (enrdf_load_stackoverflow) 1986-12-16

Family

ID=11981111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1877979A Granted JPS55110117A (en) 1979-02-19 1979-02-19 Epoxy resin hardener

Country Status (1)

Country Link
JP (1) JPS55110117A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009088059A1 (ja) * 2008-01-09 2009-07-16 Hitachi Chemical Company, Ltd. 熱硬化性樹脂組成物、エポキシ樹脂成形材料及び多価カルボン酸縮合体
JP2010100798A (ja) * 2008-01-09 2010-05-06 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、エポキシ樹脂成形材料、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2010106226A (ja) * 2008-01-11 2010-05-13 Hitachi Chem Co Ltd 多価カルボン酸縮合体、並びにこれを用いたエポキシ樹脂用硬化剤、エポキシ樹脂組成物、ポリアミド樹脂及びポリエステル樹脂
JP2011213948A (ja) * 2010-04-01 2011-10-27 Hitachi Chem Co Ltd 多価カルボン酸縮合体、熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009088059A1 (ja) * 2008-01-09 2009-07-16 Hitachi Chemical Company, Ltd. 熱硬化性樹脂組成物、エポキシ樹脂成形材料及び多価カルボン酸縮合体
JP2010100798A (ja) * 2008-01-09 2010-05-06 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、エポキシ樹脂成形材料、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
US8585272B2 (en) 2008-01-09 2013-11-19 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
TWI452056B (zh) * 2008-01-09 2014-09-11 Hitachi Chemical Co Ltd 熱固性樹脂組成物、環氧樹脂成形材料以及多元羧酸縮合體
US9067906B2 (en) 2008-01-09 2015-06-30 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
JP2010106226A (ja) * 2008-01-11 2010-05-13 Hitachi Chem Co Ltd 多価カルボン酸縮合体、並びにこれを用いたエポキシ樹脂用硬化剤、エポキシ樹脂組成物、ポリアミド樹脂及びポリエステル樹脂
JP2011213948A (ja) * 2010-04-01 2011-10-27 Hitachi Chem Co Ltd 多価カルボン酸縮合体、熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Also Published As

Publication number Publication date
JPS6159327B2 (enrdf_load_stackoverflow) 1986-12-16

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