JPS55107251A - Electronic part and its packaging construction - Google Patents

Electronic part and its packaging construction

Info

Publication number
JPS55107251A
JPS55107251A JP1335879A JP1335879A JPS55107251A JP S55107251 A JPS55107251 A JP S55107251A JP 1335879 A JP1335879 A JP 1335879A JP 1335879 A JP1335879 A JP 1335879A JP S55107251 A JPS55107251 A JP S55107251A
Authority
JP
Japan
Prior art keywords
leads
tab
substrate
soldered
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1335879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6217382B2 (ko
Inventor
Susumu Okikawa
Fumihito Inoue
Takehiko Yanagida
Kazuo Shimizu
Keizo Otsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1335879A priority Critical patent/JPS55107251A/ja
Publication of JPS55107251A publication Critical patent/JPS55107251A/ja
Publication of JPS6217382B2 publication Critical patent/JPS6217382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1335879A 1979-02-09 1979-02-09 Electronic part and its packaging construction Granted JPS55107251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1335879A JPS55107251A (en) 1979-02-09 1979-02-09 Electronic part and its packaging construction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1335879A JPS55107251A (en) 1979-02-09 1979-02-09 Electronic part and its packaging construction

Publications (2)

Publication Number Publication Date
JPS55107251A true JPS55107251A (en) 1980-08-16
JPS6217382B2 JPS6217382B2 (ko) 1987-04-17

Family

ID=11830868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1335879A Granted JPS55107251A (en) 1979-02-09 1979-02-09 Electronic part and its packaging construction

Country Status (1)

Country Link
JP (1) JPS55107251A (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138945A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 封止型半導体装置
JPS60138944A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 封止型半導体装置
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US5105261A (en) * 1989-03-30 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device package having particular lead structure for mounting multiple circuit boards

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4421066Y1 (ko) * 1966-07-20 1969-09-08
JPS4964373A (ko) * 1972-06-23 1974-06-21
JPS5145977A (ja) * 1974-10-17 1976-04-19 Nippon Electric Co Jushifushigatahandotaisochi

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4421066Y1 (ko) * 1966-07-20 1969-09-08
JPS4964373A (ko) * 1972-06-23 1974-06-21
JPS5145977A (ja) * 1974-10-17 1976-04-19 Nippon Electric Co Jushifushigatahandotaisochi

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138945A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 封止型半導体装置
JPS60138944A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 封止型半導体装置
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US5105261A (en) * 1989-03-30 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device package having particular lead structure for mounting multiple circuit boards

Also Published As

Publication number Publication date
JPS6217382B2 (ko) 1987-04-17

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