JPS55107247A - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPS55107247A JPS55107247A JP1474079A JP1474079A JPS55107247A JP S55107247 A JPS55107247 A JP S55107247A JP 1474079 A JP1474079 A JP 1474079A JP 1474079 A JP1474079 A JP 1474079A JP S55107247 A JPS55107247 A JP S55107247A
- Authority
- JP
- Japan
- Prior art keywords
- board
- case
- adhered
- metal plate
- adhesive agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To complete superior heat conductive sealing highly resistance to temperature changes by a construction wherein part of the surface of a ceramic board and a case made of resin are adhered together with soft adhesive agent, and a metal plate is adhered to the back surface of the board by the use of a hard adhesive agent, then the board is adhered to the resin case.
CONSTITUTION: The end of a ceramic board 8 on an external lead 14 side and a case 10 made of resin are adhered together with a soft adhesive agent 13, and another end is only engaged with the step 10b of the case. As a result, the board is not affected by stress caused by difference in thermal expansion coefficient. Si grease 18 is inserted into a space between the board 8 and a metal plate 15 to improve heat conduction, and one side of the lead 14 of the metal plate 15 is adhered to the board 8 with a hard adhesive agent 16, then the other 3 sides are adhered to the resin case 10 with the same adhesive agent 16. Therefore, the occurrence of faulty sealing can be reduced because it is possible to decrease the difference in thermal expansion coefficient by selecting the materials for the case 10 and the metal plate 15, and no inferior temperature cycle occurs because of the free flexibility of the board against the case and metal plate.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1474079A JPS55107247A (en) | 1979-02-09 | 1979-02-09 | Hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1474079A JPS55107247A (en) | 1979-02-09 | 1979-02-09 | Hybrid integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55107247A true JPS55107247A (en) | 1980-08-16 |
Family
ID=11869512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1474079A Pending JPS55107247A (en) | 1979-02-09 | 1979-02-09 | Hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55107247A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100709832B1 (en) * | 1999-08-06 | 2007-04-23 | 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 | Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package |
-
1979
- 1979-02-09 JP JP1474079A patent/JPS55107247A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100709832B1 (en) * | 1999-08-06 | 2007-04-23 | 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 | Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package |
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