JPS55107239A - Device for manufacturing semiconductor device - Google Patents

Device for manufacturing semiconductor device

Info

Publication number
JPS55107239A
JPS55107239A JP1455679A JP1455679A JPS55107239A JP S55107239 A JPS55107239 A JP S55107239A JP 1455679 A JP1455679 A JP 1455679A JP 1455679 A JP1455679 A JP 1455679A JP S55107239 A JPS55107239 A JP S55107239A
Authority
JP
Japan
Prior art keywords
sheets
base plate
needles
caused
backup ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1455679A
Other languages
Japanese (ja)
Inventor
Teruo Kusakari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1455679A priority Critical patent/JPS55107239A/en
Publication of JPS55107239A publication Critical patent/JPS55107239A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To curtail the time for process by unnecessitating the transport of adsorption nozzles, and adjustment of relative positions of push needles, sheets and element fitting members, and fitting a plurality of elements at a time.
CONSTITUTION: Sheet 291W295 are delivered by rotary members 36 and 37, and positioning of a base plate (element fitting member) 26 push needles 211W213 by an XY bedplate 25, thereafter a backup ring 38 being caused to descend to apply tension to the sheets. In order to improve the extensibility of the sheets, the sheets are suitably heated. The distance between the backup ring 38 and the base plate 26 is selected to be about 1.70W1.75mm, and the needles 211W213 are caused to descend, the LED element 33 being pressed against the base plate 26 side under a pressure of about 200g. Thereafter, when, next to the backup ring 38, the needles 211W213 are lifted, the element 33 is exfoliated from the sheets 291W295, and caused to adhere to the base plate 26 applied beforehand with a conductive bonding agent. When these operations are repeated, the LED33 is mounted on the base plate in a predetermined arrangement.
COPYRIGHT: (C)1980,JPO&Japio
JP1455679A 1979-02-10 1979-02-10 Device for manufacturing semiconductor device Pending JPS55107239A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1455679A JPS55107239A (en) 1979-02-10 1979-02-10 Device for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1455679A JPS55107239A (en) 1979-02-10 1979-02-10 Device for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
JPS55107239A true JPS55107239A (en) 1980-08-16

Family

ID=11864415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1455679A Pending JPS55107239A (en) 1979-02-10 1979-02-10 Device for manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS55107239A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054338A (en) * 1996-05-17 2000-04-25 National Semiconductor Corporation Low cost ball grid array device and method of manufacture thereof
US6140708A (en) * 1996-05-17 2000-10-31 National Semiconductor Corporation Chip scale package and method for manufacture thereof
US6284566B1 (en) 1996-05-17 2001-09-04 National Semiconductor Corporation Chip scale package and method for manufacture thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054338A (en) * 1996-05-17 2000-04-25 National Semiconductor Corporation Low cost ball grid array device and method of manufacture thereof
US6140708A (en) * 1996-05-17 2000-10-31 National Semiconductor Corporation Chip scale package and method for manufacture thereof
US6284566B1 (en) 1996-05-17 2001-09-04 National Semiconductor Corporation Chip scale package and method for manufacture thereof

Similar Documents

Publication Publication Date Title
DE3072031D1 (en) Process for producing a solder connection between a semiconductor device and a carrier substrate, and a semiconductor device made by such method
JPS55107239A (en) Device for manufacturing semiconductor device
JPS52147064A (en) Semiconductor device
JPS53141573A (en) Pellet dividing method of semiconductor wafer
JPS55138839A (en) Method of fabricating semiconductor device
JPS51121262A (en) Method of manufacturing semiconductor devices
JPS5228262A (en) Process for assembling semiconductor device
JPS5618451A (en) Manufacture of substrate for semiconductor device
JPS52156551A (en) Semiconductor wafer breaking method
JPS51139260A (en) Method of manufacturing semi_conductor device
JPS5585037A (en) Bonding method
JPS5258463A (en) Production of semiconductor device
JPS5766632A (en) Semiconductor integrated circuit device
JPS5630732A (en) Mounting method of semiconductor pellet
JPS5412265A (en) Production of semiconductor elements
GB1453923A (en) Soldering machines and methods
JPS5383581A (en) Manufacture of semiconductor device
JPS6461284A (en) Method and screen for printing pattern
JPS6329939A (en) Screen printer
JPS5216971A (en) Base plate heat treatment method and wafer for semiconductor
JPS5438772A (en) Semiconductor element for testing
JPS57201027A (en) Dry etching method
JPS5640252A (en) Transfer positioning device for chip bonder
JPS5251872A (en) Production of semiconductor device
JPS56118345A (en) Tape carrier