GB1453923A - Soldering machines and methods - Google Patents
Soldering machines and methodsInfo
- Publication number
- GB1453923A GB1453923A GB2796075A GB2796075A GB1453923A GB 1453923 A GB1453923 A GB 1453923A GB 2796075 A GB2796075 A GB 2796075A GB 2796075 A GB2796075 A GB 2796075A GB 1453923 A GB1453923 A GB 1453923A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder
- plate
- lever
- finger
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
1453923 Soldering ILLINOIS TOOL WORKS Inc 3 July 1975 27960/75 Heading B3R [Also in Division B6] In a method for applying solder to contact points (e.g. pretinned ends of a ceramic chip capacitor) of an electrical component 16 having a flat surface 74, a retaining finger 50 biased by a spring 48 presses the component 16 on to a solder-rejecting flat metal plate 40 (the plate 40 and finger 50 preferably of Ti) such that no solder will penetrate between the plate 40 and the flat surface 74. An automatic indexed rotary table 12 has a plurality of the plates 40 around its periphery, its operation being as follows. The component 16 is transferred by a pivotable vacuum probe 22 from a pick up station 20, adjacent a vibratory feeder 18 to a vacuum holding platform 55 from where a pusher member 56 pushes it between the spring biased finger 59 and the plate 40, the spring being neutralized by a lever 51 (Fig. 10). While on the platform 55 an identifying indicia is applied by a pivotable printing element 260 (Fig. 10). As the table 12 rotates in the direction of arrow 64 the components pass through a preheater 76 before tubes of solder 88, 90 are fed by air driven and idle rollers 92, 94 over the ends of 102, 104 of the components 16. A flash lamp 110, adjacent the rollers 92, 94, melts the solder over the end. The soldered components are removed by an unloading arm 118 with the assistance of a lever similar to the lever 51. A cam controlled indexing device is disclosed for the automatic control of the operational sequence.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2796075A GB1453923A (en) | 1975-07-03 | 1975-07-03 | Soldering machines and methods |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2796075A GB1453923A (en) | 1975-07-03 | 1975-07-03 | Soldering machines and methods |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1453923A true GB1453923A (en) | 1976-10-27 |
Family
ID=10268035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2796075A Expired GB1453923A (en) | 1975-07-03 | 1975-07-03 | Soldering machines and methods |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1453923A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111786229A (en) * | 2020-07-28 | 2020-10-16 | 安徽蓝锐电子科技有限公司 | Pencil feed separator |
CN112935255A (en) * | 2021-01-26 | 2021-06-11 | 安徽和丰硬质合金有限公司 | Forging and pressing forming processing device for tungsten-cobalt alloy powder |
-
1975
- 1975-07-03 GB GB2796075A patent/GB1453923A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111786229A (en) * | 2020-07-28 | 2020-10-16 | 安徽蓝锐电子科技有限公司 | Pencil feed separator |
CN111786229B (en) * | 2020-07-28 | 2022-03-25 | 安徽蓝锐电子科技有限公司 | Pencil feed separator |
CN112935255A (en) * | 2021-01-26 | 2021-06-11 | 安徽和丰硬质合金有限公司 | Forging and pressing forming processing device for tungsten-cobalt alloy powder |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |