GB1453923A - Soldering machines and methods - Google Patents

Soldering machines and methods

Info

Publication number
GB1453923A
GB1453923A GB2796075A GB2796075A GB1453923A GB 1453923 A GB1453923 A GB 1453923A GB 2796075 A GB2796075 A GB 2796075A GB 2796075 A GB2796075 A GB 2796075A GB 1453923 A GB1453923 A GB 1453923A
Authority
GB
United Kingdom
Prior art keywords
solder
plate
lever
finger
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2796075A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Priority to GB2796075A priority Critical patent/GB1453923A/en
Publication of GB1453923A publication Critical patent/GB1453923A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10984Component carrying a connection agent, e.g. solder, adhesive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

1453923 Soldering ILLINOIS TOOL WORKS Inc 3 July 1975 27960/75 Heading B3R [Also in Division B6] In a method for applying solder to contact points (e.g. pretinned ends of a ceramic chip capacitor) of an electrical component 16 having a flat surface 74, a retaining finger 50 biased by a spring 48 presses the component 16 on to a solder-rejecting flat metal plate 40 (the plate 40 and finger 50 preferably of Ti) such that no solder will penetrate between the plate 40 and the flat surface 74. An automatic indexed rotary table 12 has a plurality of the plates 40 around its periphery, its operation being as follows. The component 16 is transferred by a pivotable vacuum probe 22 from a pick up station 20, adjacent a vibratory feeder 18 to a vacuum holding platform 55 from where a pusher member 56 pushes it between the spring biased finger 59 and the plate 40, the spring being neutralized by a lever 51 (Fig. 10). While on the platform 55 an identifying indicia is applied by a pivotable printing element 260 (Fig. 10). As the table 12 rotates in the direction of arrow 64 the components pass through a preheater 76 before tubes of solder 88, 90 are fed by air driven and idle rollers 92, 94 over the ends of 102, 104 of the components 16. A flash lamp 110, adjacent the rollers 92, 94, melts the solder over the end. The soldered components are removed by an unloading arm 118 with the assistance of a lever similar to the lever 51. A cam controlled indexing device is disclosed for the automatic control of the operational sequence.
GB2796075A 1975-07-03 1975-07-03 Soldering machines and methods Expired GB1453923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2796075A GB1453923A (en) 1975-07-03 1975-07-03 Soldering machines and methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2796075A GB1453923A (en) 1975-07-03 1975-07-03 Soldering machines and methods

Publications (1)

Publication Number Publication Date
GB1453923A true GB1453923A (en) 1976-10-27

Family

ID=10268035

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2796075A Expired GB1453923A (en) 1975-07-03 1975-07-03 Soldering machines and methods

Country Status (1)

Country Link
GB (1) GB1453923A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111786229A (en) * 2020-07-28 2020-10-16 安徽蓝锐电子科技有限公司 Pencil feed separator
CN112935255A (en) * 2021-01-26 2021-06-11 安徽和丰硬质合金有限公司 Forging and pressing forming processing device for tungsten-cobalt alloy powder

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111786229A (en) * 2020-07-28 2020-10-16 安徽蓝锐电子科技有限公司 Pencil feed separator
CN111786229B (en) * 2020-07-28 2022-03-25 安徽蓝锐电子科技有限公司 Pencil feed separator
CN112935255A (en) * 2021-01-26 2021-06-11 安徽和丰硬质合金有限公司 Forging and pressing forming processing device for tungsten-cobalt alloy powder

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee