JPS5487684A - Vacuum evaporation method - Google Patents

Vacuum evaporation method

Info

Publication number
JPS5487684A
JPS5487684A JP14243178A JP14243178A JPS5487684A JP S5487684 A JPS5487684 A JP S5487684A JP 14243178 A JP14243178 A JP 14243178A JP 14243178 A JP14243178 A JP 14243178A JP S5487684 A JPS5487684 A JP S5487684A
Authority
JP
Japan
Prior art keywords
vacuum evaporation
evaporation method
vacuum
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14243178A
Other languages
English (en)
Other versions
JPS5534225B2 (ja
Inventor
Furanshisu Doriyuu Roorando
Jiyon Shiyumitsuto Jiy Furanku
Jieroomu Bandeyuihobun Toomasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5487684A publication Critical patent/JPS5487684A/ja
Publication of JPS5534225B2 publication Critical patent/JPS5534225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/09—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the vapour phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/10—Deposition methods
    • C03C2218/15—Deposition methods from the vapour phase
JP14243178A 1977-12-21 1978-11-20 Vacuum evaporation method Granted JPS5487684A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86279777A 1977-12-21 1977-12-21

Publications (2)

Publication Number Publication Date
JPS5487684A true JPS5487684A (en) 1979-07-12
JPS5534225B2 JPS5534225B2 (ja) 1980-09-05

Family

ID=25339379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14243178A Granted JPS5487684A (en) 1977-12-21 1978-11-20 Vacuum evaporation method

Country Status (5)

Country Link
EP (1) EP0002738B1 (ja)
JP (1) JPS5487684A (ja)
CA (1) CA1105093A (ja)
DE (1) DE2861042D1 (ja)
IT (1) IT1160293B (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56145135A (en) * 1980-04-13 1981-11-11 Matsushita Electric Ind Co Ltd Deposition method
JPH0234916A (ja) * 1988-03-01 1990-02-05 Texas Instr Inc <Ti> 放射誘導によるパターン付着法
JPH04104903A (ja) * 1990-08-21 1992-04-07 Kokusai Chodendo Sangyo Gijutsu Kenkyu Center 酸化物高温超電導薄膜の製造方法
JPH06104551A (ja) * 1992-09-21 1994-04-15 Miyachi Technos Kk 印刷配線板の製造方法及びガラス板に配線を印刷する方法
JPH06299339A (ja) * 1993-04-12 1994-10-25 Tokyo Name Plate Kogyo Kyodo Kumiai レーザ光照射による金属薄膜蒸着法
JP2005079245A (ja) * 2003-08-29 2005-03-24 Institute Of Physical & Chemical Research 金属配線形成方法および金属配線形成装置
JP2014040666A (ja) * 2006-04-17 2014-03-06 Imra America Inc ｐ型半導体酸化亜鉛膜の製造方法、及び透明基板を使用したパルスレーザ堆積方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3112460C2 (de) * 1981-03-28 1983-01-20 Fried. Krupp Gmbh, 4300 Essen Verfahren zur Herstellung eines Verbundkörpers sowie Anwendung dieses Verfahrens
JPS6066896A (ja) * 1983-09-16 1985-04-17 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 基体に金属銅を付着するための方法
DE3472574D1 (en) * 1983-10-14 1988-08-11 Hitachi Ltd Process for forming an organic thin film
FR2576147B1 (fr) * 1985-01-17 1987-11-27 Flicstein Jean Procede de depot et de cristallisation d'une couche mince de materiau organique au moyen d'un faisceau d'energie
JPS6321501A (ja) * 1986-07-15 1988-01-29 Kawasaki Steel Corp 塗装膜厚測定方法
DE4232373A1 (de) * 1992-09-03 1994-03-10 Deutsche Forsch Luft Raumfahrt Verfahren zum Auftragen strukturierter Schichten
DE4330961C1 (de) * 1993-09-09 1994-07-28 Krone Ag Verfahren zur Herstellung von strukturierten Metallisierungen auf Oberflächen
FI103396B1 (fi) 1994-03-24 1999-06-30 Laserplus Oy Menetelmä ja laite merkkausten tekemiseksi lasipintaan
DE19517625A1 (de) * 1995-05-13 1996-11-14 Budenheim Rud A Oetker Chemie Verfahren zum musterförmigen Bedrucken fester Substratoberflächen
US6657802B1 (en) 1999-04-16 2003-12-02 Infineon Technologies Corporation Phase assisted synchronization detector
WO2003040427A1 (en) * 2001-10-16 2003-05-15 Data Storage Institute Thin film deposition by laser irradiation
SG122749A1 (en) 2001-10-16 2006-06-29 Inst Data Storage Method of laser marking and apparatus therefor
CN100436155C (zh) * 2006-08-15 2008-11-26 北京工业大学 一种基于透明材料的激光快速热升华印刷方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560258A (en) * 1966-07-22 1971-02-02 Int Standard Electric Corp Pattern deposit by laser
JPS4913159A (ja) * 1972-04-11 1974-02-05
JPS49109273A (ja) * 1973-02-22 1974-10-17

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE314461B (ja) * 1965-03-01 1969-09-08 Ibm
GB1138556A (en) * 1966-07-22 1969-01-01 Standard Telephones Cables Ltd Method of vapour depositing a material in the form of a pattern
DE1621306A1 (de) * 1967-01-17 1971-04-29 Philips Patentverwaltung Verfahren zum Aufdampfen von duennen Schichten hoechster Reinheit und Anordnung zur Durchfuehrung des Verfahrens
DE2523982C3 (de) * 1975-05-30 1979-05-17 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren und Einrichtung zur maskenlosen Bedampfung, sowie Verwendung des Verfahrens

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560258A (en) * 1966-07-22 1971-02-02 Int Standard Electric Corp Pattern deposit by laser
JPS4913159A (ja) * 1972-04-11 1974-02-05
JPS49109273A (ja) * 1973-02-22 1974-10-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56145135A (en) * 1980-04-13 1981-11-11 Matsushita Electric Ind Co Ltd Deposition method
JPS64335B2 (ja) * 1980-04-13 1989-01-06 Matsushita Electric Ind Co Ltd
JPH0234916A (ja) * 1988-03-01 1990-02-05 Texas Instr Inc <Ti> 放射誘導によるパターン付着法
JPH04104903A (ja) * 1990-08-21 1992-04-07 Kokusai Chodendo Sangyo Gijutsu Kenkyu Center 酸化物高温超電導薄膜の製造方法
JPH06104551A (ja) * 1992-09-21 1994-04-15 Miyachi Technos Kk 印刷配線板の製造方法及びガラス板に配線を印刷する方法
JPH06299339A (ja) * 1993-04-12 1994-10-25 Tokyo Name Plate Kogyo Kyodo Kumiai レーザ光照射による金属薄膜蒸着法
JP2005079245A (ja) * 2003-08-29 2005-03-24 Institute Of Physical & Chemical Research 金属配線形成方法および金属配線形成装置
JP2014040666A (ja) * 2006-04-17 2014-03-06 Imra America Inc ｐ型半導体酸化亜鉛膜の製造方法、及び透明基板を使用したパルスレーザ堆積方法

Also Published As

Publication number Publication date
IT7830412A0 (it) 1978-12-01
IT1160293B (it) 1987-03-11
DE2861042D1 (en) 1981-11-26
EP0002738A1 (de) 1979-07-11
JPS5534225B2 (ja) 1980-09-05
CA1105093A (en) 1981-07-14
EP0002738B1 (de) 1981-09-02

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