JPS5485672A - Semiconcutor device - Google Patents
Semiconcutor deviceInfo
- Publication number
- JPS5485672A JPS5485672A JP15393977A JP15393977A JPS5485672A JP S5485672 A JPS5485672 A JP S5485672A JP 15393977 A JP15393977 A JP 15393977A JP 15393977 A JP15393977 A JP 15393977A JP S5485672 A JPS5485672 A JP S5485672A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- rolled copper
- reliability
- lead frame
- semiconcutor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15393977A JPS5485672A (en) | 1977-12-20 | 1977-12-20 | Semiconcutor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15393977A JPS5485672A (en) | 1977-12-20 | 1977-12-20 | Semiconcutor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5485672A true JPS5485672A (en) | 1979-07-07 |
| JPS6126220B2 JPS6126220B2 (enExample) | 1986-06-19 |
Family
ID=15573374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15393977A Granted JPS5485672A (en) | 1977-12-20 | 1977-12-20 | Semiconcutor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5485672A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387725U (enExample) * | 1986-11-27 | 1988-06-08 |
-
1977
- 1977-12-20 JP JP15393977A patent/JPS5485672A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6126220B2 (enExample) | 1986-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5411682A (en) | Semiconductor device | |
| JPS5441067A (en) | Production of semiconductor devices | |
| JPS5436595A (en) | Preparation of bubble memory chip | |
| JPS52154358A (en) | Production of semiconductor device | |
| JPS5419652A (en) | Lead bonding method | |
| JPS51151069A (en) | Electrode forming method of a semiconductor element | |
| JPS55110051A (en) | Lead frame and semiconductor device | |
| JPS5310266A (en) | Production of soldred semiconductor wafers | |
| JPS52143764A (en) | Metal connecting method | |
| JPS5419375A (en) | Semiconductor device | |
| JPS5416979A (en) | Production of semiconuctor device | |
| JPS535571A (en) | Circuit block and its manufacture | |
| JPS5392677A (en) | Manufacture of semiconductor element equipment with plated heat sink | |
| JPS5223270A (en) | Method of manufacturing lead frames for semiconductors | |
| JPS5295526A (en) | Production of heat treatment type high tension steel of utmost thickne ss | |
| JPS5363866A (en) | Production of semiconductor device | |
| JPS54973A (en) | Semiconductor element | |
| JPS5443456A (en) | Low fusing-point glass sealing lead | |
| JPS5295175A (en) | Pellet bonding | |
| JPS5391623A (en) | Noise rejecting circuit for solid state pick up unit | |
| JPS53128986A (en) | Manufacture of semiconductor device | |
| JPS5386184A (en) | Semiconductor device and its production | |
| JPS5272186A (en) | Production of mis type semiconductor device | |
| JPS5410676A (en) | Production of semiconductor device | |
| JPS548127A (en) | Manufacture of wire plated with low melting point metal |