JPS5483766A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5483766A
JPS5483766A JP15196477A JP15196477A JPS5483766A JP S5483766 A JPS5483766 A JP S5483766A JP 15196477 A JP15196477 A JP 15196477A JP 15196477 A JP15196477 A JP 15196477A JP S5483766 A JPS5483766 A JP S5483766A
Authority
JP
Japan
Prior art keywords
brazing material
brazing
fusion
semiconductor
preventive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15196477A
Other languages
Japanese (ja)
Inventor
Yuuji Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15196477A priority Critical patent/JPS5483766A/en
Publication of JPS5483766A publication Critical patent/JPS5483766A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To secure the thickness of a brazing material between an element and passive reflector or stem without loosing the wetability of the brazing material by providing an outflow preventive part for the brazing material encircling the place, where the semiconductor is brazed into a bank shape.
CONSTITUTION: Brazing-material outflow preventive body 5 made of a brazing material formed previously in a circular bank shape and inert metal is fusion- connected or welded onto cooling body 6, to which semiconductor 7 is fusion- connected by soft brazing material 8, so that it will be possible to make constant thickness 9 of the sost brazing material between element 7 and cooling body 6 by using preventive body 5.
COPYRIGHT: (C)1979,JPO&Japio
JP15196477A 1977-12-16 1977-12-16 Semiconductor device Pending JPS5483766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15196477A JPS5483766A (en) 1977-12-16 1977-12-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15196477A JPS5483766A (en) 1977-12-16 1977-12-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5483766A true JPS5483766A (en) 1979-07-04

Family

ID=15530053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15196477A Pending JPS5483766A (en) 1977-12-16 1977-12-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5483766A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015144228A (en) * 2013-12-24 2015-08-06 アイシン精機株式会社 semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015144228A (en) * 2013-12-24 2015-08-06 アイシン精機株式会社 semiconductor device

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