JPS5422166A - Manufacture of buffer plate for semiconductor device - Google Patents
Manufacture of buffer plate for semiconductor deviceInfo
- Publication number
- JPS5422166A JPS5422166A JP8702177A JP8702177A JPS5422166A JP S5422166 A JPS5422166 A JP S5422166A JP 8702177 A JP8702177 A JP 8702177A JP 8702177 A JP8702177 A JP 8702177A JP S5422166 A JPS5422166 A JP S5422166A
- Authority
- JP
- Japan
- Prior art keywords
- buffer plate
- manufacture
- semiconductor device
- cladding
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To secure a stable and solid adhesion between the substrate, the buffer plate and the radiator by having cladding to the solder material on the metal plate surface through several times of the cold rolling work.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8702177A JPS5422166A (en) | 1977-07-19 | 1977-07-19 | Manufacture of buffer plate for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8702177A JPS5422166A (en) | 1977-07-19 | 1977-07-19 | Manufacture of buffer plate for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5422166A true JPS5422166A (en) | 1979-02-19 |
Family
ID=13903295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8702177A Pending JPS5422166A (en) | 1977-07-19 | 1977-07-19 | Manufacture of buffer plate for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5422166A (en) |
-
1977
- 1977-07-19 JP JP8702177A patent/JPS5422166A/en active Pending
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