JPS5422166A - Manufacture of buffer plate for semiconductor device - Google Patents

Manufacture of buffer plate for semiconductor device

Info

Publication number
JPS5422166A
JPS5422166A JP8702177A JP8702177A JPS5422166A JP S5422166 A JPS5422166 A JP S5422166A JP 8702177 A JP8702177 A JP 8702177A JP 8702177 A JP8702177 A JP 8702177A JP S5422166 A JPS5422166 A JP S5422166A
Authority
JP
Japan
Prior art keywords
buffer plate
manufacture
semiconductor device
cladding
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8702177A
Other languages
Japanese (ja)
Inventor
Kenji Hideshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8702177A priority Critical patent/JPS5422166A/en
Publication of JPS5422166A publication Critical patent/JPS5422166A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To secure a stable and solid adhesion between the substrate, the buffer plate and the radiator by having cladding to the solder material on the metal plate surface through several times of the cold rolling work.
COPYRIGHT: (C)1979,JPO&Japio
JP8702177A 1977-07-19 1977-07-19 Manufacture of buffer plate for semiconductor device Pending JPS5422166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8702177A JPS5422166A (en) 1977-07-19 1977-07-19 Manufacture of buffer plate for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8702177A JPS5422166A (en) 1977-07-19 1977-07-19 Manufacture of buffer plate for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5422166A true JPS5422166A (en) 1979-02-19

Family

ID=13903295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8702177A Pending JPS5422166A (en) 1977-07-19 1977-07-19 Manufacture of buffer plate for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5422166A (en)

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