JPS547869A - Lead bending method of semiconductor device - Google Patents

Lead bending method of semiconductor device

Info

Publication number
JPS547869A
JPS547869A JP7344777A JP7344777A JPS547869A JP S547869 A JPS547869 A JP S547869A JP 7344777 A JP7344777 A JP 7344777A JP 7344777 A JP7344777 A JP 7344777A JP S547869 A JPS547869 A JP S547869A
Authority
JP
Japan
Prior art keywords
semiconductor device
bending method
lead bending
package
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7344777A
Other languages
English (en)
Japanese (ja)
Other versions
JPS619739B2 (enrdf_load_stackoverflow
Inventor
Toshinori Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7344777A priority Critical patent/JPS547869A/ja
Publication of JPS547869A publication Critical patent/JPS547869A/ja
Publication of JPS619739B2 publication Critical patent/JPS619739B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7344777A 1977-06-20 1977-06-20 Lead bending method of semiconductor device Granted JPS547869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7344777A JPS547869A (en) 1977-06-20 1977-06-20 Lead bending method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7344777A JPS547869A (en) 1977-06-20 1977-06-20 Lead bending method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS547869A true JPS547869A (en) 1979-01-20
JPS619739B2 JPS619739B2 (enrdf_load_stackoverflow) 1986-03-25

Family

ID=13518475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7344777A Granted JPS547869A (en) 1977-06-20 1977-06-20 Lead bending method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS547869A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59192075A (ja) * 1983-04-12 1984-10-31 Dainippon Ink & Chem Inc アロエ抽出物の苦味改良法
JPS63297393A (ja) * 1987-05-29 1988-12-05 Toshiro Ishii 蜜柑薬液の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62197228U (enrdf_load_stackoverflow) * 1986-06-05 1987-12-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59192075A (ja) * 1983-04-12 1984-10-31 Dainippon Ink & Chem Inc アロエ抽出物の苦味改良法
JPS63297393A (ja) * 1987-05-29 1988-12-05 Toshiro Ishii 蜜柑薬液の製造方法

Also Published As

Publication number Publication date
JPS619739B2 (enrdf_load_stackoverflow) 1986-03-25

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