JPS5476061A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5476061A
JPS5476061A JP14412277A JP14412277A JPS5476061A JP S5476061 A JPS5476061 A JP S5476061A JP 14412277 A JP14412277 A JP 14412277A JP 14412277 A JP14412277 A JP 14412277A JP S5476061 A JPS5476061 A JP S5476061A
Authority
JP
Japan
Prior art keywords
reticule
read
stage
assured
facilitated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14412277A
Other languages
Japanese (ja)
Inventor
Hiroshi Koshimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14412277A priority Critical patent/JPS5476061A/en
Publication of JPS5476061A publication Critical patent/JPS5476061A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To ensure the simple and assured read-out as well as to secure the facilitated keeping and arrangement of the input data by memorizing the bonding pad position via the reticule of the photo mask.
CONSTITUTION: Reticule mask 2' baked from the actual reticule is put on XY stage 4. And the and position is measured based on the reference point through microscope 5 and by shifting stage 4, and then read out by scale 6 coupling to stage 4 to be supplied to the memory unit of the auto-wire bonder. Thus, the simple and assured read-out is ensured, at the same time ensuring the facilitated keeping and arrangement for the input data.
COPYRIGHT: (C)1979,JPO&Japio
JP14412277A 1977-11-30 1977-11-30 Manufacture of semiconductor device Pending JPS5476061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14412277A JPS5476061A (en) 1977-11-30 1977-11-30 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14412277A JPS5476061A (en) 1977-11-30 1977-11-30 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5476061A true JPS5476061A (en) 1979-06-18

Family

ID=15354696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14412277A Pending JPS5476061A (en) 1977-11-30 1977-11-30 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5476061A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Similar Documents

Publication Publication Date Title
JPS5363961A (en) Semiconductor integrated circuit
JPS5476061A (en) Manufacture of semiconductor device
JPS5318972A (en) Monitoring method of wafer positioning state by probes
JPS547279A (en) Socket adapter for ic measurement
JPS52119874A (en) Semi-conductor device
JPS5413272A (en) Measuring unit for semiconductor
JPS5293361A (en) Automatic tester
JPS52115188A (en) Prober
JPS51121267A (en) Semiconductor wafer measuring device
JPS53102684A (en) Semiconductor memory device
JPS5516453A (en) Tape for holding semiconductor device
JPS5413783A (en) Photoelectric transducer
JPS5387258A (en) Measuring device
JPS5534484A (en) Manufacture of semiconductor device
JPS5427372A (en) Manufacture of semiconductor device
JPS53141584A (en) Measuring instrument of semiconductor device
JPS53115186A (en) Integrated circuit device
JPS52101979A (en) Semiconductor device
JPS5360169A (en) Semiconductor integrated circuit device
JPS5429539A (en) Test system for integrated circuit
JPS5419357A (en) Production of semiconductor device
JPS53142880A (en) Manufacture for semicondoctor device
JPS5326679A (en) Defect analyzer for semiconductor integrated circuit
JPS5354325A (en) Combustion control device
JPS5327364A (en) Film carrier integrated circuit and its production