JPS5471986A - Semiconductor device and production thereof - Google Patents

Semiconductor device and production thereof

Info

Publication number
JPS5471986A
JPS5471986A JP13870677A JP13870677A JPS5471986A JP S5471986 A JPS5471986 A JP S5471986A JP 13870677 A JP13870677 A JP 13870677A JP 13870677 A JP13870677 A JP 13870677A JP S5471986 A JPS5471986 A JP S5471986A
Authority
JP
Japan
Prior art keywords
substrate
hole
adhesive tape
semiconductor element
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13870677A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5620704B2 (enExample
Inventor
Kenji Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13870677A priority Critical patent/JPS5471986A/ja
Publication of JPS5471986A publication Critical patent/JPS5471986A/ja
Publication of JPS5620704B2 publication Critical patent/JPS5620704B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/019—
    • H10P72/74—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W74/142—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP13870677A 1977-11-18 1977-11-18 Semiconductor device and production thereof Granted JPS5471986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13870677A JPS5471986A (en) 1977-11-18 1977-11-18 Semiconductor device and production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13870677A JPS5471986A (en) 1977-11-18 1977-11-18 Semiconductor device and production thereof

Publications (2)

Publication Number Publication Date
JPS5471986A true JPS5471986A (en) 1979-06-08
JPS5620704B2 JPS5620704B2 (enExample) 1981-05-15

Family

ID=15228214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13870677A Granted JPS5471986A (en) 1977-11-18 1977-11-18 Semiconductor device and production thereof

Country Status (1)

Country Link
JP (1) JPS5471986A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0273740U (enExample) * 1988-11-25 1990-06-05
US5273938A (en) * 1989-09-06 1993-12-28 Motorola, Inc. Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film
WO1997039482A1 (en) * 1996-04-18 1997-10-23 Tessera, Inc. Methods for manufacturing a semiconductor package
US6583444B2 (en) 1997-02-18 2003-06-24 Tessera, Inc. Semiconductor packages having light-sensitive chips
US7165316B2 (en) 1996-04-18 2007-01-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
JP2007235791A (ja) * 2006-03-03 2007-09-13 Epson Toyocom Corp 圧電デバイス
US7288739B2 (en) * 2001-02-26 2007-10-30 Sts Atl Corporation Method of forming an opening or cavity in a substrate for receiving an electronic component
EP1914803A1 (en) * 2006-10-20 2008-04-23 Broadcom Corporation Low profile ball grid array (BGA) package witth exposed die and method of making same
EP1856733A4 (en) * 2004-09-28 2009-09-23 Agilight Inc METHOD FOR MICROPACKING LEDS AND MICROPACKING

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0467905U (enExample) * 1990-10-22 1992-06-16

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5441671A (en) * 1977-09-08 1979-04-03 Sharp Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5441671A (en) * 1977-09-08 1979-04-03 Sharp Corp Semiconductor device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0273740U (enExample) * 1988-11-25 1990-06-05
US5273938A (en) * 1989-09-06 1993-12-28 Motorola, Inc. Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film
WO1997039482A1 (en) * 1996-04-18 1997-10-23 Tessera, Inc. Methods for manufacturing a semiconductor package
US6001671A (en) * 1996-04-18 1999-12-14 Tessera, Inc. Methods for manufacturing a semiconductor package having a sacrificial layer
US7165316B2 (en) 1996-04-18 2007-01-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
US7095054B2 (en) 1997-02-18 2006-08-22 Tessera, Inc. Semiconductor package having light sensitive chips
US6888168B2 (en) 1997-02-18 2005-05-03 Tessera, Inc. Semiconductor package having light sensitive chips
US6583444B2 (en) 1997-02-18 2003-06-24 Tessera, Inc. Semiconductor packages having light-sensitive chips
US7288739B2 (en) * 2001-02-26 2007-10-30 Sts Atl Corporation Method of forming an opening or cavity in a substrate for receiving an electronic component
EP1856733A4 (en) * 2004-09-28 2009-09-23 Agilight Inc METHOD FOR MICROPACKING LEDS AND MICROPACKING
JP2007235791A (ja) * 2006-03-03 2007-09-13 Epson Toyocom Corp 圧電デバイス
EP1914803A1 (en) * 2006-10-20 2008-04-23 Broadcom Corporation Low profile ball grid array (BGA) package witth exposed die and method of making same
US8169067B2 (en) 2006-10-20 2012-05-01 Broadcom Corporation Low profile ball grid array (BGA) package with exposed die and method of making same

Also Published As

Publication number Publication date
JPS5620704B2 (enExample) 1981-05-15

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