JPS5620704B2 - - Google Patents
Info
- Publication number
- JPS5620704B2 JPS5620704B2 JP13870677A JP13870677A JPS5620704B2 JP S5620704 B2 JPS5620704 B2 JP S5620704B2 JP 13870677 A JP13870677 A JP 13870677A JP 13870677 A JP13870677 A JP 13870677A JP S5620704 B2 JPS5620704 B2 JP S5620704B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W74/019—
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- H10P72/74—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5522—
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- H10W72/884—
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- H10W74/00—
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- H10W74/142—
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- H10W90/734—
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- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13870677A JPS5471986A (en) | 1977-11-18 | 1977-11-18 | Semiconductor device and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13870677A JPS5471986A (en) | 1977-11-18 | 1977-11-18 | Semiconductor device and production thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5471986A JPS5471986A (en) | 1979-06-08 |
| JPS5620704B2 true JPS5620704B2 (enExample) | 1981-05-15 |
Family
ID=15228214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13870677A Granted JPS5471986A (en) | 1977-11-18 | 1977-11-18 | Semiconductor device and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5471986A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0467905U (enExample) * | 1990-10-22 | 1992-06-16 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0273740U (enExample) * | 1988-11-25 | 1990-06-05 | ||
| US5200362A (en) * | 1989-09-06 | 1993-04-06 | Motorola, Inc. | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
| US6001671A (en) * | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
| US6821821B2 (en) | 1996-04-18 | 2004-11-23 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
| US6583444B2 (en) | 1997-02-18 | 2003-06-24 | Tessera, Inc. | Semiconductor packages having light-sensitive chips |
| US7288739B2 (en) * | 2001-02-26 | 2007-10-30 | Sts Atl Corporation | Method of forming an opening or cavity in a substrate for receiving an electronic component |
| JP2008515236A (ja) * | 2004-09-28 | 2008-05-08 | アジライト・インコーポレーテッド | Ｌｅｄを微細実装するための方法及びマイクロパッケージ |
| JP2007235791A (ja) * | 2006-03-03 | 2007-09-13 | Epson Toyocom Corp | 圧電デバイス |
| US8169067B2 (en) | 2006-10-20 | 2012-05-01 | Broadcom Corporation | Low profile ball grid array (BGA) package with exposed die and method of making same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441671A (en) * | 1977-09-08 | 1979-04-03 | Sharp Corp | Semiconductor device |
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1977
- 1977-11-18 JP JP13870677A patent/JPS5471986A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0467905U (enExample) * | 1990-10-22 | 1992-06-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5471986A (en) | 1979-06-08 |