JPS5454570A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5454570A
JPS5454570A JP12097877A JP12097877A JPS5454570A JP S5454570 A JPS5454570 A JP S5454570A JP 12097877 A JP12097877 A JP 12097877A JP 12097877 A JP12097877 A JP 12097877A JP S5454570 A JPS5454570 A JP S5454570A
Authority
JP
Japan
Prior art keywords
bonding wires
edges
screen plates
make non
shorting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12097877A
Other languages
Japanese (ja)
Inventor
Takeshi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12097877A priority Critical patent/JPS5454570A/en
Publication of JPS5454570A publication Critical patent/JPS5454570A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE:To prevent shorting by providing screen plates which make non-parallel contact with bonding wires and are perpendicular to these at electrode deriving lead edges. CONSTITUTION:Upright screen plates 12E, 12B are provided at the edges of electrode leads 2E, 2B in the positions where bonding wires run and the bonding wires make non-parallel contact with the top edges thereof. This contitution enables undesirable contact shorting of bonding wires during production process.
JP12097877A 1977-10-11 1977-10-11 Semiconductor device Pending JPS5454570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12097877A JPS5454570A (en) 1977-10-11 1977-10-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12097877A JPS5454570A (en) 1977-10-11 1977-10-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5454570A true JPS5454570A (en) 1979-04-28

Family

ID=14799741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12097877A Pending JPS5454570A (en) 1977-10-11 1977-10-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5454570A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101357430B1 (en) * 2005-12-29 2014-02-06 엑사테크 엘.엘.씨. Electrical connection to printed circuits on plastic panels

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101357430B1 (en) * 2005-12-29 2014-02-06 엑사테크 엘.엘.씨. Electrical connection to printed circuits on plastic panels

Similar Documents

Publication Publication Date Title
JPS528785A (en) Semiconductor device electrode structure
JPS5454570A (en) Semiconductor device
NL164329C (en) ELECTROLYSIS DEVICE WITH BALANCED BIPOLAR ELECTRODES.
JPS5370688A (en) Production of semoconductor device
JPS5249767A (en) Semiconductor device
JPS5234391A (en) Production method of transparent electrode film
JPS5232693A (en) Semiconductor device
JPS5751928B2 (en)
JPS5346290A (en) Semiconductor device
JPS53110465A (en) Semiconductor device
JPS5226197A (en) Display unit
JPS535988A (en) Sealing structure of crystal vibrator
JPS5251173A (en) Structure for supporting dust-collecting electodes
JPS5249068A (en) Circuit device for watches
JPS51136290A (en) Short emitter type thyristor
JPS52141589A (en) Semiconductor device
JPS5258366A (en) Production of semiconductor device
JPS5299070A (en) Lead frame for semiconductor device
JPS5366369A (en) Semiconductor device
JPS5313883A (en) Semiconductor device and its production
JPS53108381A (en) Manufacture for semiconductor device
JPS51138166A (en) Production method of semiconductor device
JPS5397765A (en) Production of semiconductor device
JPS5384679A (en) Production of semiconductor device
JPS5276886A (en) Semiconductor memory device