JPS5446466A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5446466A JPS5446466A JP11286977A JP11286977A JPS5446466A JP S5446466 A JPS5446466 A JP S5446466A JP 11286977 A JP11286977 A JP 11286977A JP 11286977 A JP11286977 A JP 11286977A JP S5446466 A JPS5446466 A JP S5446466A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- holding plate
- wafer
- wax
- adhesives
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To decrease a rate of defective generation at the time of completion, by covering a pellet, which seems defective at the state of adhesion to a holding plate, with a coating material insoluble in an adhesives-dissolving solution after a semiconductor wafer is pelletized and by making it remain on the holding plate in a pellet-separation process.
CONSTITUTION: Si wafer 2 where a fixed P-type layer or N-type layer is formed is anchored onto holding plate 6 of glass, etc., by using adhesives 8 such as wax, and mesh-shaped stainless shield plate 10 is fitted onto wafer 2 via wax 12 while being positined. With shield plate 10 taken as a mask, a blast of sand is applied, and the formed layer is divided into bevel-shaped pellet 4. Afterward, measurements of electric characteristics of each pellet is exercised to distinguish between a good one and defect, and geberally, many defects are at the circumference of wafer 2. For the purpose, pellets 4 at this circumference are covered with coating film 14 insoluble in a wax dissolving solution and only exposed pellets 4 are broken away from holding plate 6 by a solution
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11286977A JPS5446466A (en) | 1977-09-19 | 1977-09-19 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11286977A JPS5446466A (en) | 1977-09-19 | 1977-09-19 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5446466A true JPS5446466A (en) | 1979-04-12 |
| JPS5751979B2 JPS5751979B2 (en) | 1982-11-05 |
Family
ID=14597555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11286977A Granted JPS5446466A (en) | 1977-09-19 | 1977-09-19 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5446466A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4714220A (en) * | 1986-01-31 | 1987-12-22 | Marketing Displays, Inc. | Sign stand assembly |
| CN103545254B (en) * | 2012-07-17 | 2016-05-25 | 大族激光科技产业集团股份有限公司 | Wafer laser processing |
| CN103537806B (en) * | 2012-07-17 | 2016-02-17 | 大族激光科技产业集团股份有限公司 | Wafer laser processing |
-
1977
- 1977-09-19 JP JP11286977A patent/JPS5446466A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5751979B2 (en) | 1982-11-05 |
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