JPS5443461A - Packing method of semiconductor wafer - Google Patents
Packing method of semiconductor waferInfo
- Publication number
- JPS5443461A JPS5443461A JP11031277A JP11031277A JPS5443461A JP S5443461 A JPS5443461 A JP S5443461A JP 11031277 A JP11031277 A JP 11031277A JP 11031277 A JP11031277 A JP 11031277A JP S5443461 A JPS5443461 A JP S5443461A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- jig
- bag
- mirror surface
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11031277A JPS5443461A (en) | 1977-09-12 | 1977-09-12 | Packing method of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11031277A JPS5443461A (en) | 1977-09-12 | 1977-09-12 | Packing method of semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5443461A true JPS5443461A (en) | 1979-04-06 |
Family
ID=14532511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11031277A Pending JPS5443461A (en) | 1977-09-12 | 1977-09-12 | Packing method of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5443461A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54159864A (en) * | 1978-06-08 | 1979-12-18 | Nec Corp | Storing package of semiconductor wafer |
JPS6473739A (en) * | 1987-09-16 | 1989-03-20 | Fujitsu Ltd | Table for wafer mounting |
JPH03232566A (ja) * | 1990-02-09 | 1991-10-16 | Furukawa Electric Co Ltd:The | 着色アルミニウム送電線およびその付属品の製造方法 |
EP0840358A2 (en) * | 1996-11-05 | 1998-05-06 | Applied Materials, Inc. | Sloped substrate support |
-
1977
- 1977-09-12 JP JP11031277A patent/JPS5443461A/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54159864A (en) * | 1978-06-08 | 1979-12-18 | Nec Corp | Storing package of semiconductor wafer |
JPS6146970B2 (ja) * | 1978-06-08 | 1986-10-16 | Nippon Electric Co | |
JPS6473739A (en) * | 1987-09-16 | 1989-03-20 | Fujitsu Ltd | Table for wafer mounting |
JPH03232566A (ja) * | 1990-02-09 | 1991-10-16 | Furukawa Electric Co Ltd:The | 着色アルミニウム送電線およびその付属品の製造方法 |
EP0840358A2 (en) * | 1996-11-05 | 1998-05-06 | Applied Materials, Inc. | Sloped substrate support |
EP0840358A3 (en) * | 1996-11-05 | 2004-01-14 | Applied Materials, Inc. | Sloped substrate support |
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