JPS5424265B2 - - Google Patents

Info

Publication number
JPS5424265B2
JPS5424265B2 JP15876775A JP15876775A JPS5424265B2 JP S5424265 B2 JPS5424265 B2 JP S5424265B2 JP 15876775 A JP15876775 A JP 15876775A JP 15876775 A JP15876775 A JP 15876775A JP S5424265 B2 JPS5424265 B2 JP S5424265B2
Authority
JP
Japan
Prior art keywords
ppm
amount
gold
alloy
germanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15876775A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5282183A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15876775A priority Critical patent/JPS5282183A/ja
Priority to US05/755,012 priority patent/US4080485A/en
Publication of JPS5282183A publication Critical patent/JPS5282183A/ja
Publication of JPS5424265B2 publication Critical patent/JPS5424265B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07511—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/884—
    • H10W72/952—
    • H10W90/736—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/02—Contacts, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
JP15876775A 1975-12-29 1975-12-29 Connecting wires for semiconductor devices Granted JPS5282183A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP15876775A JPS5282183A (en) 1975-12-29 1975-12-29 Connecting wires for semiconductor devices
US05/755,012 US4080485A (en) 1975-12-29 1976-12-28 Fine gold wire for use in connection in a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15876775A JPS5282183A (en) 1975-12-29 1975-12-29 Connecting wires for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5282183A JPS5282183A (en) 1977-07-09
JPS5424265B2 true JPS5424265B2 (enExample) 1979-08-20

Family

ID=15678882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15876775A Granted JPS5282183A (en) 1975-12-29 1975-12-29 Connecting wires for semiconductor devices

Country Status (2)

Country Link
US (1) US4080485A (enExample)
JP (1) JPS5282183A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1597712A (en) * 1977-01-17 1981-09-09 Plessey Co Ltd Display devices
US4330329A (en) * 1979-11-28 1982-05-18 Tanaka Denshi Kogyo Kabushiki Kaisha Gold bonding wire for semiconductor elements and the semiconductor element
JPS56115543A (en) * 1980-02-15 1981-09-10 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5688329A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5676556A (en) * 1979-11-28 1981-06-24 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
JPS5688328A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS56115544A (en) * 1980-02-15 1981-09-10 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5696844A (en) * 1979-12-29 1981-08-05 Tanaka Denshi Kogyo Kk Semiconductor element
GB2116208B (en) * 1981-12-04 1985-12-04 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
JPS58154241A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置及びその製法
JPS5928553A (ja) * 1982-08-11 1984-02-15 Hitachi Ltd 耐食性アルミニウム配線材料
US4775512A (en) * 1985-10-01 1988-10-04 Tanaka Denshi Kogyo Kabushiki Kaisha Gold line for bonding semiconductor element
JPS62278241A (ja) * 1986-05-26 1987-12-03 Shoei Kagaku Kogyo Kk ボンデイングワイヤ
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
JPH01146336A (ja) * 1987-12-03 1989-06-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH0749794Y2 (ja) * 1989-03-15 1995-11-13 三菱マテリアル株式会社 ワイヤレスボンデイング用金バンプ
GB2231336B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device
JP2780611B2 (ja) * 1993-09-06 1998-07-30 三菱マテリアル株式会社 少量成分の合金化で硬質化した金装飾品材
DE19544641B4 (de) * 1994-12-05 2005-08-25 Eads Deutschland Gmbh Solarzellen-Verbinder für Raumfahrt-Solargeneratoren
US6140702A (en) * 1996-05-31 2000-10-31 Texas Instruments Incorporated Plastic encapsulation for integrated circuits having plated copper top surface level interconnect
JP3504448B2 (ja) * 1996-10-17 2004-03-08 株式会社ルネサステクノロジ 半導体装置
US6140150A (en) * 1997-05-28 2000-10-31 Texas Instruments Incorporated Plastic encapsulation for integrated circuits having plated copper top surface level interconnect
US6169331B1 (en) * 1998-08-28 2001-01-02 Micron Technology, Inc. Apparatus for electrically coupling bond pads of a microelectronic device
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP3382918B2 (ja) * 2000-05-31 2003-03-04 田中電子工業株式会社 半導体素子接続用金線
EP1811555A4 (en) * 2004-09-30 2012-06-20 Tanaka Electronics Ind AU-ALLOY BOND WIRE
US20090317291A1 (en) * 2008-06-20 2009-12-24 Annette Gertge Variable karat gold alloys
US20090317292A1 (en) * 2008-06-20 2009-12-24 Gertge Annette T Variable karat gold alloys
US9802233B2 (en) * 2014-05-01 2017-10-31 Praxair S. T. Technology, Inc. Gold evaporative sources with reduced contaminants and methods for making the same
US10854476B2 (en) * 2018-08-06 2020-12-01 Sj Semiconductor (Jiangyin) Corporation Semiconductor vertical wire bonding structure and method

Also Published As

Publication number Publication date
US4080485A (en) 1978-03-21
JPS5282183A (en) 1977-07-09

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