JPS54153866A - Resin molding and its mold - Google Patents
Resin molding and its moldInfo
- Publication number
- JPS54153866A JPS54153866A JP6107478A JP6107478A JPS54153866A JP S54153866 A JPS54153866 A JP S54153866A JP 6107478 A JP6107478 A JP 6107478A JP 6107478 A JP6107478 A JP 6107478A JP S54153866 A JPS54153866 A JP S54153866A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- casting
- mold
- sucking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6107478A JPS54153866A (en) | 1978-05-24 | 1978-05-24 | Resin molding and its mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6107478A JPS54153866A (en) | 1978-05-24 | 1978-05-24 | Resin molding and its mold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54153866A true JPS54153866A (en) | 1979-12-04 |
Family
ID=13160615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6107478A Pending JPS54153866A (en) | 1978-05-24 | 1978-05-24 | Resin molding and its mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54153866A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6237119A (ja) * | 1985-08-10 | 1987-02-18 | Fujitsu Ltd | モ−ルド金型およびモ−ルド方法 |
JPS63167732U (ja) * | 1987-04-23 | 1988-11-01 | ||
US5082615A (en) * | 1987-12-18 | 1992-01-21 | Mitsubishi Denki Kabushiki Kaisha | Method for packaging semiconductor devices in a resin |
US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
US7677874B2 (en) * | 2007-02-02 | 2010-03-16 | Asm Technology Singapore Pte Ltd | Vacuum molding apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4967824A (ja) * | 1972-11-06 | 1974-07-01 | ||
JPS5080375A (ja) * | 1973-11-20 | 1975-06-30 | ||
JPS5117983A (en) * | 1974-08-05 | 1976-02-13 | Daicel Ltd | Furanjitsugiteno seizohohoto sonosochi |
-
1978
- 1978-05-24 JP JP6107478A patent/JPS54153866A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4967824A (ja) * | 1972-11-06 | 1974-07-01 | ||
JPS5080375A (ja) * | 1973-11-20 | 1975-06-30 | ||
JPS5117983A (en) * | 1974-08-05 | 1976-02-13 | Daicel Ltd | Furanjitsugiteno seizohohoto sonosochi |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6237119A (ja) * | 1985-08-10 | 1987-02-18 | Fujitsu Ltd | モ−ルド金型およびモ−ルド方法 |
JPS63167732U (ja) * | 1987-04-23 | 1988-11-01 | ||
US5082615A (en) * | 1987-12-18 | 1992-01-21 | Mitsubishi Denki Kabushiki Kaisha | Method for packaging semiconductor devices in a resin |
US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
US5484274A (en) * | 1992-11-24 | 1996-01-16 | Neu Dynamics Corp. | Encapsulation molding equipment |
US7677874B2 (en) * | 2007-02-02 | 2010-03-16 | Asm Technology Singapore Pte Ltd | Vacuum molding apparatus |
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