JPS54125144A - Treating device using hydrogen fluoride-containing gas - Google Patents
Treating device using hydrogen fluoride-containing gasInfo
- Publication number
- JPS54125144A JPS54125144A JP3286578A JP3286578A JPS54125144A JP S54125144 A JPS54125144 A JP S54125144A JP 3286578 A JP3286578 A JP 3286578A JP 3286578 A JP3286578 A JP 3286578A JP S54125144 A JPS54125144 A JP S54125144A
- Authority
- JP
- Japan
- Prior art keywords
- cooled
- etching
- container
- gas
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 title 1
- 239000007789 gas Substances 0.000 title 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 title 1
- 238000005530 etching Methods 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3286578A JPS54125144A (en) | 1978-03-24 | 1978-03-24 | Treating device using hydrogen fluoride-containing gas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3286578A JPS54125144A (en) | 1978-03-24 | 1978-03-24 | Treating device using hydrogen fluoride-containing gas |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54125144A true JPS54125144A (en) | 1979-09-28 |
| JPS558593B2 JPS558593B2 (enrdf_load_stackoverflow) | 1980-03-05 |
Family
ID=12370739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3286578A Granted JPS54125144A (en) | 1978-03-24 | 1978-03-24 | Treating device using hydrogen fluoride-containing gas |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54125144A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954227A (ja) * | 1982-09-21 | 1984-03-29 | Tokyo Denshi Kagaku Kabushiki | 乾式パタ−ン形成方法 |
| JPS59166675A (ja) * | 1983-03-11 | 1984-09-20 | Fujitsu Ltd | エツチング装置 |
| JPH03107479A (ja) * | 1989-09-22 | 1991-05-07 | Nec Corp | ドライエッチング装置 |
| US5173152A (en) * | 1989-10-02 | 1992-12-22 | Dainippon Screen Mfg. Co., Ltd. | Method for selectively removing an insulating film |
| JPH07169756A (ja) * | 1994-11-07 | 1995-07-04 | Semiconductor Energy Lab Co Ltd | プラズマエッチング方法 |
| JPH08306675A (ja) * | 1996-05-13 | 1996-11-22 | Semiconductor Energy Lab Co Ltd | プラズマエッチング方法 |
| KR101874821B1 (ko) * | 2016-04-05 | 2018-07-06 | 주식회사 테스 | 저온 공정을 이용한 실리콘산화막의 선택적 식각 방법 |
| JP2023506400A (ja) * | 2019-12-03 | 2023-02-16 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | 少なくとも1つの半導体基板を処理するための装置および方法 |
-
1978
- 1978-03-24 JP JP3286578A patent/JPS54125144A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954227A (ja) * | 1982-09-21 | 1984-03-29 | Tokyo Denshi Kagaku Kabushiki | 乾式パタ−ン形成方法 |
| JPS59166675A (ja) * | 1983-03-11 | 1984-09-20 | Fujitsu Ltd | エツチング装置 |
| JPH03107479A (ja) * | 1989-09-22 | 1991-05-07 | Nec Corp | ドライエッチング装置 |
| US5173152A (en) * | 1989-10-02 | 1992-12-22 | Dainippon Screen Mfg. Co., Ltd. | Method for selectively removing an insulating film |
| JPH07169756A (ja) * | 1994-11-07 | 1995-07-04 | Semiconductor Energy Lab Co Ltd | プラズマエッチング方法 |
| JPH08306675A (ja) * | 1996-05-13 | 1996-11-22 | Semiconductor Energy Lab Co Ltd | プラズマエッチング方法 |
| KR101874821B1 (ko) * | 2016-04-05 | 2018-07-06 | 주식회사 테스 | 저온 공정을 이용한 실리콘산화막의 선택적 식각 방법 |
| JP2023506400A (ja) * | 2019-12-03 | 2023-02-16 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | 少なくとも1つの半導体基板を処理するための装置および方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS558593B2 (enrdf_load_stackoverflow) | 1980-03-05 |
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