JPS54123874A - Air tight sealing method for ic chip - Google Patents
Air tight sealing method for ic chipInfo
- Publication number
- JPS54123874A JPS54123874A JP3094078A JP3094078A JPS54123874A JP S54123874 A JPS54123874 A JP S54123874A JP 3094078 A JP3094078 A JP 3094078A JP 3094078 A JP3094078 A JP 3094078A JP S54123874 A JPS54123874 A JP S54123874A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tint
- chip
- sealed
- sealing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Ceramic Products (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53030940A JPS6047746B2 (ja) | 1978-03-20 | 1978-03-20 | Icチップの気密封止方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53030940A JPS6047746B2 (ja) | 1978-03-20 | 1978-03-20 | Icチップの気密封止方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54123874A true JPS54123874A (en) | 1979-09-26 |
JPS6047746B2 JPS6047746B2 (ja) | 1985-10-23 |
Family
ID=12317666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53030940A Expired JPS6047746B2 (ja) | 1978-03-20 | 1978-03-20 | Icチップの気密封止方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6047746B2 (ja) |
-
1978
- 1978-03-20 JP JP53030940A patent/JPS6047746B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6047746B2 (ja) | 1985-10-23 |
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