JPS5456767A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5456767A
JPS5456767A JP12365677A JP12365677A JPS5456767A JP S5456767 A JPS5456767 A JP S5456767A JP 12365677 A JP12365677 A JP 12365677A JP 12365677 A JP12365677 A JP 12365677A JP S5456767 A JPS5456767 A JP S5456767A
Authority
JP
Japan
Prior art keywords
gold plating
thin
cap
semiconductor device
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12365677A
Other languages
Japanese (ja)
Inventor
Shozo Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12365677A priority Critical patent/JPS5456767A/en
Publication of JPS5456767A publication Critical patent/JPS5456767A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain a highly reliable semiconductor device which is connected with the thin wire of Al or Al alloy by giving thin gold plating to the top surface of the lead terminal and thick gold plating to the outside exposed part respectively.
CONSTITUTION: Thin gold plating 5 is given of the entire surface of metal stem 1'; cap 10 made of rubber or the like is put on metal header 2; and cap 10 and header 2 are sealed together via lead terminal 4 and metal cap 8. In this case, thick gold plating 9 is given only to the outside exposed part. In such constitution, thin gold film 5 exists on the top surface of terminal 4 which is connected with thin wire 7 of Al or Al alloy, so that the occurrence of the resistance fault caused by the compound grown between gold and Al can be prevented. Furthermore, the outside exosed part is covered with the thick gold film, thus avoiding the deterioration caused by oxidation while the device is working. Thus, a highly reliable semiconductor device can be obtained
COPYRIGHT: (C)1979,JPO&Japio
JP12365677A 1977-10-14 1977-10-14 Semiconductor device Pending JPS5456767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12365677A JPS5456767A (en) 1977-10-14 1977-10-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12365677A JPS5456767A (en) 1977-10-14 1977-10-14 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5456767A true JPS5456767A (en) 1979-05-08

Family

ID=14866007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12365677A Pending JPS5456767A (en) 1977-10-14 1977-10-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5456767A (en)

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