JPS54101264A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54101264A JPS54101264A JP721078A JP721078A JPS54101264A JP S54101264 A JPS54101264 A JP S54101264A JP 721078 A JP721078 A JP 721078A JP 721078 A JP721078 A JP 721078A JP S54101264 A JPS54101264 A JP S54101264A
- Authority
- JP
- Japan
- Prior art keywords
- anode tab
- semiconductor device
- resin
- semiconductor pellet
- traversally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP721078A JPS54101264A (en) | 1978-01-27 | 1978-01-27 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP721078A JPS54101264A (en) | 1978-01-27 | 1978-01-27 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54101264A true JPS54101264A (en) | 1979-08-09 |
Family
ID=11659632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP721078A Pending JPS54101264A (en) | 1978-01-27 | 1978-01-27 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54101264A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4862246A (en) * | 1984-09-26 | 1989-08-29 | Hitachi, Ltd. | Semiconductor device lead frame with etched through holes |
US4862586A (en) * | 1985-02-28 | 1989-09-05 | Michio Osada | Lead frame for enclosing semiconductor chips with resin |
-
1978
- 1978-01-27 JP JP721078A patent/JPS54101264A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4862246A (en) * | 1984-09-26 | 1989-08-29 | Hitachi, Ltd. | Semiconductor device lead frame with etched through holes |
US4862586A (en) * | 1985-02-28 | 1989-09-05 | Michio Osada | Lead frame for enclosing semiconductor chips with resin |
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