JPS522280A - Diode - Google Patents

Diode

Info

Publication number
JPS522280A
JPS522280A JP7671175A JP7671175A JPS522280A JP S522280 A JPS522280 A JP S522280A JP 7671175 A JP7671175 A JP 7671175A JP 7671175 A JP7671175 A JP 7671175A JP S522280 A JPS522280 A JP S522280A
Authority
JP
Japan
Prior art keywords
lead
resin
diode
leadwire
moded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7671175A
Other languages
Japanese (ja)
Other versions
JPS6034264B2 (en
Inventor
Takeo Sato
Osamu Ito
Kazutaka Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50076711A priority Critical patent/JPS6034264B2/en
Publication of JPS522280A publication Critical patent/JPS522280A/en
Publication of JPS6034264B2 publication Critical patent/JPS6034264B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: A resin molded part having a vertical surface with respect to the lengthwise direction of a lead is protruded in a direction of folding the lead, in order to prevent the breakage of the resin when the lead is folded at a leadwire attaching part of diode that is moded with a resin.
COPYRIGHT: (C)1977,JPO&Japio
JP50076711A 1975-06-24 1975-06-24 diode Expired JPS6034264B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50076711A JPS6034264B2 (en) 1975-06-24 1975-06-24 diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50076711A JPS6034264B2 (en) 1975-06-24 1975-06-24 diode

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59083701A Division JPS6024047A (en) 1984-04-27 1984-04-27 Diode

Publications (2)

Publication Number Publication Date
JPS522280A true JPS522280A (en) 1977-01-08
JPS6034264B2 JPS6034264B2 (en) 1985-08-07

Family

ID=13613114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50076711A Expired JPS6034264B2 (en) 1975-06-24 1975-06-24 diode

Country Status (1)

Country Link
JP (1) JPS6034264B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024047A (en) * 1984-04-27 1985-02-06 Hitachi Ltd Diode
US4617585A (en) * 1982-05-31 1986-10-14 Tokyo Shibaura Denki Kabushiki Kaisha Plastic enclosing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617585A (en) * 1982-05-31 1986-10-14 Tokyo Shibaura Denki Kabushiki Kaisha Plastic enclosing device
JPS6024047A (en) * 1984-04-27 1985-02-06 Hitachi Ltd Diode

Also Published As

Publication number Publication date
JPS6034264B2 (en) 1985-08-07

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