JPS522280A - Diode - Google Patents

Diode

Info

Publication number
JPS522280A
JPS522280A JP7671175A JP7671175A JPS522280A JP S522280 A JPS522280 A JP S522280A JP 7671175 A JP7671175 A JP 7671175A JP 7671175 A JP7671175 A JP 7671175A JP S522280 A JPS522280 A JP S522280A
Authority
JP
Japan
Prior art keywords
lead
resin
diode
leadwire
moded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7671175A
Other languages
Japanese (ja)
Other versions
JPS6034264B2 (en
Inventor
Takeo Sato
Osamu Ito
Kazutaka Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50076711A priority Critical patent/JPS6034264B2/en
Publication of JPS522280A publication Critical patent/JPS522280A/en
Publication of JPS6034264B2 publication Critical patent/JPS6034264B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: A resin molded part having a vertical surface with respect to the lengthwise direction of a lead is protruded in a direction of folding the lead, in order to prevent the breakage of the resin when the lead is folded at a leadwire attaching part of diode that is moded with a resin.
COPYRIGHT: (C)1977,JPO&Japio
JP50076711A 1975-06-24 1975-06-24 diode Expired JPS6034264B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50076711A JPS6034264B2 (en) 1975-06-24 1975-06-24 diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50076711A JPS6034264B2 (en) 1975-06-24 1975-06-24 diode

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59083701A Division JPS6024047A (en) 1984-04-27 1984-04-27 Diode

Publications (2)

Publication Number Publication Date
JPS522280A true JPS522280A (en) 1977-01-08
JPS6034264B2 JPS6034264B2 (en) 1985-08-07

Family

ID=13613114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50076711A Expired JPS6034264B2 (en) 1975-06-24 1975-06-24 diode

Country Status (1)

Country Link
JP (1) JPS6034264B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024047A (en) * 1984-04-27 1985-02-06 Hitachi Ltd Diode
US4617585A (en) * 1982-05-31 1986-10-14 Tokyo Shibaura Denki Kabushiki Kaisha Plastic enclosing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617585A (en) * 1982-05-31 1986-10-14 Tokyo Shibaura Denki Kabushiki Kaisha Plastic enclosing device
JPS6024047A (en) * 1984-04-27 1985-02-06 Hitachi Ltd Diode

Also Published As

Publication number Publication date
JPS6034264B2 (en) 1985-08-07

Similar Documents

Publication Publication Date Title
JPS52117941A (en) Polypropylene resin compositions
JPS52152442A (en) Polypropylene resin compositions
JPS522280A (en) Diode
JPS52127756A (en) Semiconductor unit
JPS537748A (en) Synthetic resin composition having improved light resistance and gas-stain resistance
JPS52119654A (en) Thermoplastic resin compositions
JPS5239197A (en) Electric connector
JPS52155639A (en) Preparation of melamine resin adhesive
JPS52103770A (en) Method of attaching element gasket of automotive air cleaner made of s ynthetic resin
JPS52138721A (en) Eaves trough
JPS52112639A (en) Pressure sensitive adhesive composition
JPS5250179A (en) Semiconductor device
JPS53139657A (en) Polyolefin resin composition
JPS52106674A (en) Semiconductor device
JPS5235300A (en) Curing agents for epoxy resins
JPS5384A (en) Semiconductor device
JPS5478663A (en) Resin-sealed semiconductor device
JPS52152144A (en) Integrated circuti
JPS52107095A (en) Increase of storage stability of thermosetting resin
JPS5350529A (en) Synthetic resin gutter joint
JPS52127575A (en) Asynchronous sequence circuit
JPS544689A (en) Corrugated board
JPS5315049A (en) Monostable multivibrator circuit
JPS5239157A (en) Constant voltage circuit
JPS52140815A (en) Molded coil