JPS5751928B2 - - Google Patents
Info
- Publication number
- JPS5751928B2 JPS5751928B2 JP6431375A JP6431375A JPS5751928B2 JP S5751928 B2 JPS5751928 B2 JP S5751928B2 JP 6431375 A JP6431375 A JP 6431375A JP 6431375 A JP6431375 A JP 6431375A JP S5751928 B2 JPS5751928 B2 JP S5751928B2
- Authority
- JP
- Japan
- Prior art keywords
- moderate
- price
- superior
- dispersion
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6431375A JPS51140570A (en) | 1975-05-30 | 1975-05-30 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6431375A JPS51140570A (en) | 1975-05-30 | 1975-05-30 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51140570A JPS51140570A (en) | 1976-12-03 |
JPS5751928B2 true JPS5751928B2 (ja) | 1982-11-05 |
Family
ID=13254611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6431375A Granted JPS51140570A (en) | 1975-05-30 | 1975-05-30 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51140570A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5617047A (en) * | 1979-07-20 | 1981-02-18 | Hitachi Ltd | Semiconductor device |
JPH0815193B2 (ja) * | 1986-08-12 | 1996-02-14 | 新光電気工業株式会社 | 半導体装置及びこれに用いるリードフレーム |
JPS63174347A (ja) * | 1987-01-13 | 1988-07-18 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
JPS63249358A (ja) * | 1987-04-06 | 1988-10-17 | Hitachi Ltd | 樹脂封止型半導体装置 |
JP2002110887A (ja) * | 2000-09-27 | 2002-04-12 | Rohm Co Ltd | アイランド露出型半導体装置 |
-
1975
- 1975-05-30 JP JP6431375A patent/JPS51140570A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS51140570A (en) | 1976-12-03 |
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