JPS5395582A - Manufacture for semiconductor device - Google Patents
Manufacture for semiconductor deviceInfo
- Publication number
- JPS5395582A JPS5395582A JP1036477A JP1036477A JPS5395582A JP S5395582 A JPS5395582 A JP S5395582A JP 1036477 A JP1036477 A JP 1036477A JP 1036477 A JP1036477 A JP 1036477A JP S5395582 A JPS5395582 A JP S5395582A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- gate
- film
- polycrystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To eliminate open wire of MOSFET of Si gate, by covering the metallic wiring formation part for the polycrystal Si gate and the source and drain domain with Si3N4 film and by eliminating the Si3N4 film for a given part after oxidizing the semiconductor substrate for other parts.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1036477A JPS5951153B2 (en) | 1977-02-01 | 1977-02-01 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1036477A JPS5951153B2 (en) | 1977-02-01 | 1977-02-01 | Manufacturing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5395582A true JPS5395582A (en) | 1978-08-21 |
JPS5951153B2 JPS5951153B2 (en) | 1984-12-12 |
Family
ID=11748098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1036477A Expired JPS5951153B2 (en) | 1977-02-01 | 1977-02-01 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5951153B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102036463B1 (en) | 2016-11-21 | 2019-10-24 | 닛토덴코 가부시키가이샤 | Adhesive sheet |
JP7149699B2 (en) | 2017-11-01 | 2022-10-07 | 日東電工株式会社 | Thermally conductive adhesive sheet |
JP7058106B2 (en) | 2017-11-01 | 2022-04-21 | 日東電工株式会社 | Adhesive sheet |
JP6605562B2 (en) | 2017-11-20 | 2019-11-13 | 日東電工株式会社 | Adhesive sheet |
JP6496066B1 (en) | 2017-11-20 | 2019-04-03 | 日東電工株式会社 | Reinforcement film |
JP7050498B2 (en) | 2018-01-24 | 2022-04-08 | 日東電工株式会社 | Laminated sheet and roll |
CN113166600B (en) | 2018-11-30 | 2022-08-16 | 日东电工株式会社 | Adhesive sheet |
WO2020145188A1 (en) | 2019-01-08 | 2020-07-16 | 日東電工株式会社 | Pressure-sensitive adhesive sheet |
-
1977
- 1977-02-01 JP JP1036477A patent/JPS5951153B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5951153B2 (en) | 1984-12-12 |
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