JPS5381076A - Lroduction of resin seal semiconductor device - Google Patents

Lroduction of resin seal semiconductor device

Info

Publication number
JPS5381076A
JPS5381076A JP15652576A JP15652576A JPS5381076A JP S5381076 A JPS5381076 A JP S5381076A JP 15652576 A JP15652576 A JP 15652576A JP 15652576 A JP15652576 A JP 15652576A JP S5381076 A JPS5381076 A JP S5381076A
Authority
JP
Japan
Prior art keywords
lroduction
semiconductor device
resin seal
seal semiconductor
pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15652576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6128221B2 (enrdf_load_stackoverflow
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15652576A priority Critical patent/JPS5381076A/ja
Publication of JPS5381076A publication Critical patent/JPS5381076A/ja
Publication of JPS6128221B2 publication Critical patent/JPS6128221B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15652576A 1976-12-27 1976-12-27 Lroduction of resin seal semiconductor device Granted JPS5381076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15652576A JPS5381076A (en) 1976-12-27 1976-12-27 Lroduction of resin seal semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15652576A JPS5381076A (en) 1976-12-27 1976-12-27 Lroduction of resin seal semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP17295183A Division JPS59103363A (ja) 1983-09-21 1983-09-21 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS5381076A true JPS5381076A (en) 1978-07-18
JPS6128221B2 JPS6128221B2 (enrdf_load_stackoverflow) 1986-06-28

Family

ID=15629686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15652576A Granted JPS5381076A (en) 1976-12-27 1976-12-27 Lroduction of resin seal semiconductor device

Country Status (1)

Country Link
JP (1) JPS5381076A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59103363A (ja) * 1983-09-21 1984-06-14 Hitachi Ltd 樹脂封止型半導体装置
JPS59145556A (ja) * 1983-02-09 1984-08-21 Matsushita Electric Ind Co Ltd 電子部品
JPS59147449A (ja) * 1983-02-10 1984-08-23 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JPS62238655A (ja) * 1986-04-09 1987-10-19 Nec Corp 樹脂封止型半導体装置
EP1329952A3 (de) * 2002-01-21 2009-03-04 W.C. Heraeus GmbH Verfahren zum Fixieren von Chipträgern

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59145556A (ja) * 1983-02-09 1984-08-21 Matsushita Electric Ind Co Ltd 電子部品
JPS59147449A (ja) * 1983-02-10 1984-08-23 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JPS59103363A (ja) * 1983-09-21 1984-06-14 Hitachi Ltd 樹脂封止型半導体装置
JPS62238655A (ja) * 1986-04-09 1987-10-19 Nec Corp 樹脂封止型半導体装置
EP1329952A3 (de) * 2002-01-21 2009-03-04 W.C. Heraeus GmbH Verfahren zum Fixieren von Chipträgern

Also Published As

Publication number Publication date
JPS6128221B2 (enrdf_load_stackoverflow) 1986-06-28

Similar Documents

Publication Publication Date Title
JPS5315763A (en) Resin sealed type semiconductor device
JPS5381073A (en) Oroduction of resin seal type semiconductor device and lead frame used the same
JPS5381076A (en) Lroduction of resin seal semiconductor device
JPS5294074A (en) Leading-in frame
JPS5379381A (en) Production of resin seal type semiconductor device and lead frame used forthe same
JPS52172A (en) Semiconductor
JPS5211866A (en) Resin sealing method in a semiconductor device
JPS5422459A (en) Molding of resin
JPS5231673A (en) Resin sealing method of semiconductor device
JPS53105175A (en) Lead frame for resin sealing semiconductor device
JPS5380969A (en) Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS51112273A (en) Lead frame for resin mold type semiconductor device
JPS5369581A (en) Manufacture for resin sealed type semiconductor device
JPS5287982A (en) Resin molding method of semiconductor elements
JPS5387173A (en) Molding mold
JPS5219072A (en) Semiconductor device
JPS5338974A (en) Manufacture of semiconductor device
JPS5425669A (en) Manufacture for semiconductor device
JPS5247376A (en) Process for production of resin sealed type semiconductor device
JPS54577A (en) Resin seal semiconductor device
JPS5332674A (en) Sealing structure of semiconductor device and its production
JPS526082A (en) Production method of resin-seal type semiconductor device
JPS51113465A (en) Lead frame
JPS52179A (en) Method of fabricating semiconductor
JPS52156561A (en) Resin molded semiconductor device and its production