JPS5219072A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5219072A JPS5219072A JP9426275A JP9426275A JPS5219072A JP S5219072 A JPS5219072 A JP S5219072A JP 9426275 A JP9426275 A JP 9426275A JP 9426275 A JP9426275 A JP 9426275A JP S5219072 A JPS5219072 A JP S5219072A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- thickness
- specifying
- strain
- assembling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: In order to reduce the strain which is added to the final element after assembling through sealing with resin by means of specifying the thickness of Si semiconductor pellet and the material and the thickness of metal frame which holds this.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9426275A JPS5219072A (en) | 1975-08-04 | 1975-08-04 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9426275A JPS5219072A (en) | 1975-08-04 | 1975-08-04 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5219072A true JPS5219072A (en) | 1977-01-14 |
Family
ID=14105357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9426275A Pending JPS5219072A (en) | 1975-08-04 | 1975-08-04 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5219072A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4604642A (en) * | 1983-03-28 | 1986-08-05 | Kabushiki Kaisha Toshiba | Fe-Ni-Cu leadframe |
-
1975
- 1975-08-04 JP JP9426275A patent/JPS5219072A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4604642A (en) * | 1983-03-28 | 1986-08-05 | Kabushiki Kaisha Toshiba | Fe-Ni-Cu leadframe |
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