JPS5342557A - Securing method of flip chips - Google Patents

Securing method of flip chips

Info

Publication number
JPS5342557A
JPS5342557A JP11832876A JP11832876A JPS5342557A JP S5342557 A JPS5342557 A JP S5342557A JP 11832876 A JP11832876 A JP 11832876A JP 11832876 A JP11832876 A JP 11832876A JP S5342557 A JPS5342557 A JP S5342557A
Authority
JP
Japan
Prior art keywords
flip chips
chips
securing method
substrate
flip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11832876A
Other languages
Japanese (ja)
Inventor
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP11832876A priority Critical patent/JPS5342557A/en
Publication of JPS5342557A publication Critical patent/JPS5342557A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To secure a multiplicity of chips on a substrate simply through one position aligning and enhance workability by providing guide holes of the same shape and size as those of flip chips in a substrate securing the flip chips and further beforehand mounting a guide sheet whose one surface is tackiness or adhesive property.
COPYRIGHT: (C)1978,JPO&Japio
JP11832876A 1976-09-29 1976-09-29 Securing method of flip chips Pending JPS5342557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11832876A JPS5342557A (en) 1976-09-29 1976-09-29 Securing method of flip chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11832876A JPS5342557A (en) 1976-09-29 1976-09-29 Securing method of flip chips

Publications (1)

Publication Number Publication Date
JPS5342557A true JPS5342557A (en) 1978-04-18

Family

ID=14733936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11832876A Pending JPS5342557A (en) 1976-09-29 1976-09-29 Securing method of flip chips

Country Status (1)

Country Link
JP (1) JPS5342557A (en)

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